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1458 items found
STEM microscope generates two electron beams to make holographs of atomic structure
Published: February 17, 2019
The University of Oregon, Eugene, announces that its researchers have created STEM holography, a new technique that provides improved atomic resolution of a sample's outer structure and unveils previously unseen interfaces between the sample surface and the underlying material.
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Keyence VHX 6000 microscope combines brightfield and darkfield for optimal lighting
Published: January 21, 2019
Keyence, Japan, offers the VHX-6000 digital microscope with the capability to view, capture, and measure at magnifications ranging from 20X to 2000X.
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Atomic force microscope from Asylum Research scans surface ten times faster at high resolution
Published: January 21, 2019
Oxford Instruments Asylum Research, U.K., introduces the Cypher VRS AFM, a full-featured video-rate atomic force microscope that enables researchers to measure nanoscale dynamic processes at video-rate speeds with all of the resolution, versatility, and ease of use of an Asylum Research Cypher AFM.
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Veeco wins Innovation Award for its GENxcel R&D molecular beam epitaxy system
Published: January 19, 2019
Veeco Instruments Inc., Plainview, N.Y., announces that its GENxcel R&D Molecular Beam Epitaxy System earned the 2018 Compound Semiconductor (CS) Industry Innovation Award.
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Thermo Scientific’s Lumis EBSD detector incorporates new CMOS sensor, advanced optics
Published: January 19, 2019
Thermo Scientific, Waltham, Mass., introduces the Lumis EBSD detector, which can rapidly identify crystallographic phases, grain sizes, and orientation, as well as monitor structural transformations in SEM samples.
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Zeiss invests $45 million in facility near Detroit for metrology and nondestructive testing
Published: January 19, 2019
Zeiss, Germany, has begun construction of a new 82,000 square foot facility outside Detroit that will be capable of surface defect detection, multidimensional measurement, nondestructive testing, and surface form and geometry analysis.
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Nikon wafer loader enables highly reliable loading of wafers 100 microns thick
Published: January 19, 2019
Nikon, Japan, introduces the NWL200 series, the first lineup of wafer loaders for inspection microscopes capable of loading 100-micron thin wafers.
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Global semiconductor sales reported to increase 9.8% year-to-year in November
Published: January 19, 2019
The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $41.4 billion for the month of November 2018, an increase of 9.8 percent from the November 2017 total of $37.7 billion, and 1.1 percent less than the October 2018 total of $41.8 billion.
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Bruker completes acquisition of Alicona for its optical 3D surface measurement solutions
Published: January 19, 2019
Bruker Corp., Billerica, Mass., announces that it has completed its previously announced acquisition of Alicona Imaging GmbH, a leading provider of optical-based metrology products in Austria.
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Tescan USA welcomes EDFAS member Dr. Lucille Giannuzzi as Regional Sales Manager
Published: January 19, 2019
Tescan USA Inc., Warrendale, Pa., announces that it has hired EDFAS member Dr. Lucille Giannuzzi as Regional Sales Manager for the Mid-Atlantic region because of her extensive experience in focused ion beam, scanning electron, and transmission electron microscopy, as well as her applications expertise in both the physical and life sciences.
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