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1458 items found
Buehler’s new Wilson universal hardness testers can hold several indenters and objectives
Published: February 20, 2019
Buehler, Lake Bluff, Ill., introduces the Wilson UH4000 series universal hardness testers, which are designed for high-volume production labs and the production floor.
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Buehler AutoMet grinder-polishers feature intuitive touch screen, z-axis material removal
Published: February 19, 2019
Buehler, Lake Bluff, Ill., an ITW company, introduces the AutoMet family of semi-automatic grinder-polishers that feature a new intuitive touch screen interface that is simple to learn and quick to operate.
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Rigaku and Fraunhofer partner to expand X-ray topography for semiconductor wafers
Published: February 19, 2019
Rigaku Europe SE and Fraunhofer IISB, both in Germany, announce the formation of a strategic partnership to revolutionize the characterization of semiconductor materials by x-ray topography.
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Soitec expands collaboration with Samsung Foundry on fully depleted SOI wafer supply
Published: February 19, 2019
Soitec, France, announces an expanded collaboration with Samsung Foundry to ensure the volume supply of fully depleted silicon-on-insulator (FD-SOI) wafers.
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Ultra Tec introduces expanded software toolkit and interactive graphics for IC processing
Published: February 18, 2019
Ultra Tec Manufacturing Inc., Santa Ana, Calif., announces the availability of a greatly expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station.
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ST Microelectronics to acquire majority stake in wafer manufacturer Norstel AB
Published: February 17, 2019
ST Microelectronics, Geneva, has signed an agreement to acquire a majority stake in Swedish silicon carbide wafer manufacturer Norstel AB. After closing, ST will control the entire supply chain for a portion of its SiC devices at a time of constrained global capacity, positioning itseIf for a significant growth opportunity.
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SRC sponsors semiconductor packaging research center at Purdue and Binghamton
Published: February 17, 2019
Purdue University, West Lafayette, Ind., announces the formation of the Center for Heterogeneous Integration Research in Packaging, or CHIRP, a new multimillion dollar semiconductor research center that will be co-directed by Ganesh Subbarayan, professor of mechanical engineering at Purdue, and Bahgat Sammakia, vice president for research and a distinguished professor of mechanical engineering at Binghamton University, New York.
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Global semiconductor sales increase by 13.7% in 2017 to $468.8 billion in 2018
Published: February 17, 2019
The Semiconductor Industry Association (SIA), Washington, representing U.S. leadership in semiconductor manufacturing, design, and research, announces that the global semiconductor industry posted sales of $468.8 billion in 2018, the industry’s highest-ever annual total and an increase of 13.7 percent compared to the 2017 total.
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Bruker introduces Skyscan benchtop 3D X-ray microscope with three-micron voxel size
Published: February 17, 2019
Bruker, Belgium, introduces the Skyscan 1273 benchtop 3D x-ray microscope based on micro-computed tomography technology, enabling samples with up to 500 mm length, 300 mm diameter, and a maximum weight of 20 kg to be investigated with powerful and precise positioning stages.
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Zeiss launches 3D x-ray imaging solutions for failure analysis of semiconductors
Published: February 17, 2019
Zeiss, Germany, announces that a new suite of 3D x-ray imaging solutions that provide submicron and nanoscale 3D images of features and defects buried within intact structures in advanced package 3D architectures has been developed by its scientists: Xradia Context microCT, Xradia 600-series Versa 3D XRM, and Xradia 800-series Versa 3D XRM.
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