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1458 items found
iST launches Global Smart Reliability Center to accelerate front-end validation for AI and EV applications
Published: May 15, 2025
Integrated Service Technology Inc., Taiwan, a leading provider of electronic product verification and analysis services, launched its Global Smart Reliability Center, developed in response to the growing demand for early-stage reliability testing in AI, high-performance computing, and electric vehicle applications.
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Ansys strengthens collaboration with TSMC on advanced node processes certification and 3D-IC multiphysics design solutions
Published: May 15, 2025
Through continued collaboration with TSMC, Ansys, Canonsburg, Pa., announced enhanced AI-assisted workflows for radio frequency design migration and photonic integrated circuits, and new certifications for its semiconductor solutions.
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Sigray unveils the Apex-Hybrid: a breakthrough 3D x-ray system for failure analysis and electronics reverse engineering
Published: May 15, 2025
Sigray, Inc. of Benicia, Calif. has launched the Apex-Hybrid, a breakthrough X-ray system designed to revolutionize failure analysis in semiconductor and electronics labs with interchangeable laminography and tomography modes, delivering exceptional speed and 350nm high-resolution imaging for everything from large packages and PCBs to the smallest components.
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Semiconductor takes an unconventional path from insulator to metal
Published: May 15, 2025
Scientists at the University of Tennessee, Knoxville, recently discovered that Mn3Si2Te6 changes from an insulator to an electrically conductive metal when exposed to a magnetic field.
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$11.5 million sponsorship creates new research institute
Published: May 15, 2025
Epsilon Group, India, a leading innovator in carbon black and advanced battery materials for electric vehicles and energy storage, is partnering with Tufts University in Massachusetts to launch the Tufts Epsilon Materials Institute-a new research center made possible by an $11.5 million sponsorship and dedicated to advancing materials science and engineering for global energy and sustainability solutions.
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Ultrathin conductor developed for nanoelectronics could be better than copper
Published: May 15, 2025
Stanford researchers have created ultrathin niobium phosphide films that conduct electricity better than copper and can be made at low temperatures compatible with modern chip fabrication, promising more powerful, energy-efficient electronics.
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New PCR chip design: High-pressure liquid seal solves bubble problem
Published: April 17, 2025
Researchers from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, developed a high-pressure liquid seal technique that eliminates bubble formation in PDMS-based PCR chips by proving that water vapor diffusion—not air expansion—is the main cause of bubbles.
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Celera samples the first ever Analog IC completely designed by software
Published: April 17, 2025
Celera, Alameda, Calif., the leader in fully automated, AI-enhanced analog design, is now sampling the first ever analog IC completely designed by an autonomous software platform. Using Celera’s ChipHUB platform, the company improved engineering productivity by 10x, allowing the design of a high-performance buck (DC-to-DC) converter from specification to manufacturing release in a matter of... View Article
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Siemens opens $190M Fort Worth manufacturing hub to support AI infrastructure boom
Published: April 17, 2025
Siemens, Germany, opened its $190 million electrical equipment manufacturing facility in Fort Worth, Texas. A part of the company’s Smart Infrastructure business, the site is responsible for creating reliable and efficient electrical equipment such as low-voltage switchboards necessary to meet the demand from the booming data center market and America’s AI growth. The 500,000-square-foot facility... View Article
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Non-Drip cryogenic epoxy offers electrical and thermal insulation
Published: April 17, 2025
Master Bond Inc., Hackensack, N.J., released its newest product, Master Bond EP29LPSPND-3, a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications.
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