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1458 items found
Samsung completes qualification of 8nm LPP process
Published: October 23, 2017
Samsung Electronics Co. Ltd., South Korea, announces that 8nm FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.
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Hamamatsu acquires Energetiq for its high-brightness light sources for wafer inspection
Published: October 23, 2017
Hamamatsu Photonics KK, Japan, announces an agreement to acquire Energetiq Technology Inc., Woburn, Mass., for its laser-driven light sources and extreme-ultraviolet light sources.
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High-precision SPMs based on superconducting magnets from Oxford Instruments
Published: October 23, 2017
Oxford Instruments NanoScience, England, announces it will jointly develop high-precision scanning probe microscope products based on TeslatronPT, the Cryofree superconducting magnet system from Oxford Instruments, in collaboration with CASmF Science and Technology Limited in China.
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Allied’s X-Prep CNC-based system supports failure analysis with high-definition color
Published: October 23, 2017
Allied High Tech, Rancho Dominguez, Calif., introduces the X-Prep, a specialized five-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques requiring high precision sample preparation.
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Thermo Fisher Scientific adds three systems for semiconductor failure analysis
Published: October 23, 2017
Thermo Fisher Scientific, Hillsboro, Ore., announces three new additions to its portfolio of semiconductor failure analysis workflows.
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NanoMechanics Lab enables nanoscale AFM of soft hydrogels, metals, and ceramics
Published: October 20, 2017
Bruker Corp., Santa Barbara, Calif., has released the NanoMechanics Lab, a suite of force-mapping modes that enable Dimension FastScan and Icon AFM systems for quantitative nanoscale characterization, extending from soft hydrogels and polymers to hard metals and ceramics.
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NanoAl Superalloys to present six papers about its aluminum alloys at MS&T 2017
Published: October 01, 2017
NanoAl Superalloys, Skokie, Ill., announces that its engineers will present six papers about its high-strength aluminum alloys at MS&T 2017 in Pittsburgh in October, some in conjunction with engineers from universities and other companies.
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Witec’s RISE microscope is combined with Zeiss Sigma 300 FE-SEM in joint system
Published: September 25, 2017
WITec, Germany, announces that its solution for correlative Raman-SEM imaging is now available for Zeiss Sigma 300, a field emission scanning electron microscope (FE-SEM).
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SRC forms New Science Team to develop 2025 microelectronics technology roadmap
Published: September 24, 2017
Semiconductor Research Corporation (SRC), Durham, N.C., is establishing a new $300 million initiative to create a smart, autonomous, safe, connected, efficient, and affordable future through focused, long-term research that goes beyond traditional scaling.
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Global Foundries certifies Synopsys design platform for 22nm FD-SOI process
Published: September 24, 2017
Synopsys Inc., Mountain View, Calif., announces that Global Foundries has certified the Synopsys design platform for the GF 22nm FD-SOI (22FDX) process, ensuring that designers achieve optimized implementation and predictable signoff results using industry leading digital design tools.
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