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1458 items found
Most 2017 semiconductor capital spending to be for foundry and flash memory
Published: September 24, 2017
Following a substantial increase in semiconductor capital expenditures during the first half of this year, IC Insights Inc., Scottsdale, Ariz., raised its annual semiconductor capex forecast to a record high of $80.9 billion for 2017, a 20% increase from $67.3 billion in 2016.
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Bruker AXS X-ray diffraction systems integrated with Dectris Eiger pixel detectors
Published: September 24, 2017
Bruker, Madison, Wis., and Dectris, Switzerland, announce that they have collaborated to integrate the Dectris Eiger2 R 500K hybrid photon counting pixel detector with the Bruker D8 Advance and the D8 Discover instrument platform to further improve performance for numerous X-ray diffraction applications.
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Carbon nanomaterials may replace expensive metals in electronic devices
Published: September 24, 2017
Chalmers University of Technology, Sweden, announces that its researchers have shown that carbon nanomaterials such as graphene can replace expensive metals such as tin, silver, tungsten, beryllium, and indium in electronic devices.
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Northwestern University materials engineering R&D center receives $15.6 million grant
Published: September 24, 2017
Northwestern University, Evanston, Ill., announces that its Materials Research Science and Engineering Center has received a six-year, $15.6 million grant from the National Science Foundation.
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3D optical profiler combines rotational module with high-res translation platform
Published: September 17, 2017
Sensofar Metrology, Barcelona, announces the Five Axis, a new addition to its non-contact 3D surface metrology systems that combines a high-accuracy rotational module and a high-resolution translation platform, together with advanced inspection and analysis capabilities.
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Green laser enables additive manufacturing of copper by selective laser melting
Published: September 10, 2017
The Fraunhofer Institute for Laser Technology ILT, Germany, has developed a new approach that incorporates a green laser for selective laser melting of copper materials.
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Bruker’s new XRD system combines its Turbo X-ray source with Atlas goniometer
Published: September 06, 2017
Bruker AXS, Billerica, Mass., introduces the D8 Discover Plus X-ray diffraction system, which combines the high power of its TXS-HE high-efficiency Turbo X-ray source, with the reliability and accuracy of its high-endurance Atlas goniometer.
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Fast silicon drift detector combined with EDS analysis software enables real-time imaging
Published: August 21, 2017
Oxford Instruments, Concord, Mass., introduces a real-time navigation and imaging system for the SEM that helps users interactively explore samples based on video-rate X-ray maps colored by element rather than the black and white electron image alone.
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Magnetic/electrostatic compound lens enables FIB/SEM to image sub-nanometer features
Published: August 21, 2017
Hitachi High-Technologies Corp., Tokyo, announces the development of an all-new high-performance Ethos FIB-SEM based on a newly developed magnetic/electrostatic compound lens that enables it to deliver advanced imaging performance resolving sub-nanometer features in high contrast for low-voltage SEM applications.
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Jeol InTouchScope SEM offers high sensitivity and high spatial resolution at faster speed
Published: August 21, 2017
Jeol USA, Peabody, Mass., introduces the newest addition to the Jeol InTouchScope series SEMs, the JSM-IT500HR, which features a high-brightness, long-life emitter with stable probe current.
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