-
1458 items found
Leica DM3 XL microscope system inspects wafers fast with 30% larger field of view
Published: June 19, 2017
Leica Microsystems Inc., Buffalo Grove, Ill., has developed the DM3 XL microscope inspection system for process control or defect and failure analysis in the microelectronics and semiconductor industry.
News, Magazine & Media / Industry News
Brewer Science sells its semiconductor processing equipment business unit
Published: June 19, 2017
Brewer Science, Rolla, Mo., announces that its Cee semiconductor processing equipment business unit has been sold to former Brewer Science employee Russ Pagel, who has formed a new company, Cost Effective Equipment LLC, to take over ownership and operate the business.
News, Magazine & Media / Industry News
Bruker launches next-gen WDXRF spectrometer for advanced quantitative analysis
Published: June 19, 2017
Bruker Corp., Germany, launches its S8 Tiger Series 2, the next-generation wavelength dispersive X-ray fluorescence spectrometer, said to be the most versatile WDXRF tool available for advanced quantitative elemental analysis.
News, Magazine & Media / Industry News
Compact mass spectrometer designed for analysis of semiconductor process gases
Published: June 19, 2017
JEOL USA, Peabody, Mass., introduces its new compact InfiTOF mass spectrometer, which is designed for real-time, direct gas introduction and analysis.
News, Magazine & Media / Industry News
Hitachi’s Regulus field emission SEMs feature resolution down to 0.9 nanometer
Published: June 19, 2017
Hitachi High-Technologies Corp., Japan, introduces the new Regulus series of field emission scanning electron microscopes that offer enhanced functionality with improved resolution and operability.
News, Magazine & Media / Industry News
Imec and Cascade Microtech develop pre-bond testing system for advanced 3D chips
Published: June 18, 2017
Imec, Belgium, and Cascade Microtech, Germany, announce the successful development of a fully automatic system for pre-bond testing of advanced 3D chips.
News, Magazine & Media / Industry News
Amkor Technology completes acquisition of Nanium for its semiconductor packaging
Published: June 18, 2017
Amkor Technology Inc., Tempe, Ariz., has completed the acquisition of Nanium S.A., Portugal, a provider of wafer-level fan-out semiconductor packaging solutions.
News, Magazine & Media / Industry News
Optical silicone binder extends thermal stability to >180°C for chip-scale LED packaging
Published: June 18, 2017
Dow Corning, Midland, Mich., introduces Dow Corning CL-1000 optical silicone binder, a new, more thermally stable, high-refractive-index material that is formulated to expand design options for high-power chip-scale LED packaging (CSP).
News, Magazine & Media / Industry News
IBM technology for building transistors from silicon nanosheets will enable 5nm chips
Published: June 18, 2017
IBM, Armonk, N.Y., announces the development of the first industry process for building silicon nanosheet transistors that will enable 5nm chips.
News, Magazine & Media / Industry News
Global semiconductor sales increase by 21% year-to-year in April
Published: June 18, 2017
The Semiconductor Industry Association, Washington, D.C., reports that worldwide sales of semiconductors reached $31.3 billion for the month of April 2017, an increase of 20.9 percent from the April 2016 total of $25.9 billion, and 1.3 percent more than the March total of $30.9 billion.
News, Magazine & Media / Industry News
