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1458 items found
Superelasticity measured on nanometer pillars of Cu-Ni-Al shape-memory alloy
Published: June 12, 2017
UPV/EHU-University of the Basque Country, Spain, announces that its researchers have explored superelasticity properties on a nanometer scale based on shearing a Cu-14Al-4Ni shape-memory alloy's pillars down to nanometric size.
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Germanium extracted from ore by injecting organic molecules and shaking milling jars
Published: June 12, 2017
McGill University, Montreal, announces that a team of chemists has developed a way to process metals with organic molecules, instead of chlorine and hydrochloric acid, to help purify germanium.
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University in England completes $4.5 million TEM microscope and ion accelerator
Published: May 30, 2017
The University of Huddersfield, England, announces the completion of a $4.5 million research facility that includes a transmission electron microscope and a dual-beam ion beam accelerator.
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Anton Paar Revetest3 coating scratch tester enables automatic detection of critical loads
Published: May 23, 2017
Anton Paar USA, Ashland, Va., presents the third generation of the Revetest scratch tester, the RST3, the only scratch tester on the market that features automatic detection of critical loads.
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Barium-tin-oxide transparent thin film could improve electronics and solar cells
Published: May 22, 2017
The University of Minnesota, Minneapolis, announces that a team of researchers has developed a barium-tin-oxide transparent highly conductive thin film in which they replaced elemental tin with a chemical precursor of tin.
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Ultratech dual-beam laser spike anneal systems to treat FinFET for 10-nm nodes
Published: May 21, 2017
Ultratech Inc., San Jose, Calif., announces that it has received a multiple system follow-on order for its LSA101 dual-beam laser spike anneal systems for expansion of 10-nm FinFET production.
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WIN Semiconductors completes expansion, increases GaAs wafer capacity by 20%
Published: May 21, 2017
WIN Semiconductors Corp., Taiwan, has completed Phase 2 expansion at its newest wafer fab, Fab C, increasing manufacturing capacity by 20%.
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Rogers to exhibit high-performance circuit materials at microwave symposium
Published: May 21, 2017
Rogers Corp., Chandler, Ariz., will highlight its wide range of circuit materials at the 2017 IEEE International Microwave Symposium in June.
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CMOS-based electron backscatter diffraction detector acquires 3000 patterns/second
Published: May 21, 2017
Oxford Instruments Nanoanalysis, England, has launched Symmetry, which is said to have acquisition speed in excess of 3000 indexed patterns per second.
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Kyocera certified to supply ceramic semiconductor packaging for space vehicles
Published: May 21, 2017
Kyocera International Inc., San Diego, announces that it has received Class Y certification for its semiconductor assembly operations.
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