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1458 items found
Two-sensor-tool imaging technology detects dead open faults with high accuracy
Published: May 21, 2017
Neocera, Beltsville, Md., has developed the Magma electronic fault isolation HiRes microscope system that combines two sensors into one tool: a SQUID sensor for detecting the smallest possible currents, and a magnetoresistive sensor for best spatial resolution when scanning close to the current.
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Oxford Instruments to sell Industrial Analysis business to Hitachi High-Technologies
Published: May 14, 2017
Oxford Instruments plc, England, announces that it has agreed to sell its Industrial Analysis business to Hitachi High-Technologies Corp. for a consideration of $100 million on a cash and debt-free basis.
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Hitachi ion-milling system capable of high-speed and wide-area material processing
Published: May 14, 2017
Hitachi High-Technologies Corp., Tokyo, announces the Hitachi ArBlade 5000 broad ion-milling system, which enables high throughput and prepares wide-area cross-sectional samples.
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Lasertec hybrid confocal microscope combines laser and white light sources
Published: May 14, 2017
Lasertec, Japan, introduces the Optelics Hybrid confocal microscope, in which laser and white light sources are combined in one body, for a multi-functional high-performance confocal microscope.
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Jeol scanning electron microscope features ultrahigh resolution images of large samples
Published: May 14, 2017
JEOL USA, Peabody, Mass., introduces a new scanning electron microscope that combines the performance of a field emission SEM with the simplicity of the JEOL InTouchScope SEM series.
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Germanium oxide dissolves on liquid metal films to make crystalline semiconductors
Published: May 13, 2017
The University of Michigan, Ann Arbor, reports that its chemists have invented a method to simultaneously synthesize and deposit germanium crystalline semiconductor films from water at room temperature using equipment that can be assembled for just a few dollars.
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Optomec and partners develop cost-effective copper inks for printed electronics
Published: May 07, 2017
Optomec, Albuquerque, N.M., announces significant improvements in the ability to effectively print and post-process copper and copper/nickel (i.e., Constantan) inks on its Aerosol Jet systems.
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ClassOne copper plating chamber cuts costs for plating 200-mm wafers by 95%
Published: April 24, 2017
ClassOne Technology, Kalispell, Montana, has developed the CopperMax plating chamber, a design that is said to extend bath life by a factor greater than 20.
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Global semiconductor wafer-level equipment revenue increased 11% in 2016
Published: April 24, 2017
Gartner Inc., Stamford, Conn., reports that worldwide semiconductor wafer-level manufacturing equipment (WFE) revenue totaled $37.4 billion in 2016, an 11.3% increase from 2015.
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Black phosphorus could replace silicon in semiconductors to make smaller devices
Published: April 24, 2017
Yale University, New Haven, Conn., announces that a research team recently discovered that black phosphorus could possibly replace silicon as the primary material for electronics.
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