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1458 items found
New STEM electron microscope pixel array detector multiplies image information
Published: April 03, 2017
Cornell University, Ithaca, N.Y., announces that its physicists have developed an electron microscope pixel array detector (EMPAD) for scanning transmission electron microscopes that extracts much more information from the image than possible with conventional detectors.
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Buehler supports ASM World Training Center with metallographic and test equipment
Published: April 02, 2017
ASM International, Materials Park, Ohio, announces that Buehler, an ITW Company in Lake Bluff, Ill., has renewed its collaboration with ASM by supporting the ASM World Training Center with new metallographic and test instruments.
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Hitachi launches transmission electron microscope with improved electro-optics.
Published: March 20, 2017
Hitachi High-Technologies Corp., Tokyo, introduces the HT7800 Series Transmission Electron Microscope, which features digital operation under normal room light conditions (like the HT7700 model) and also incorporates improved electro-optics with many new functions.
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Jeol module enables mass spectrometer materials analysis by ambient ionization
Published: March 20, 2017
Jeol, Peabody, Mass., announces that a new FilterSpray module developed for the AccuTOF-Dart Mass Spectrometer makes it possible to spot a sample on a disposable paper triangle for analysis by ambient ionization.
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Hitachi launches transmission electron microscope with improved electro-optics
Published: March 20, 2017
Hitachi High-Technologies Corp., Tokyo, introduces the HT7800 Series Transmission Electron Microscope, which features digital operation under normal room light conditions (like the HT7700 model) and also incorporates improved electro-optics with many new functions.
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Cadence to collaborate with TSMC for design innovation with its 12FFC process
Published: March 20, 2017
Cadence Design Systems Inc., San Jose, Calif., announces its collaboration with the Taiwan Semiconductor Manufacturing Co. (TSMC) to further advanced-node design innovation with TSMC's new 12nm FinFET Compact (12FFC) process technology.
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Bruker SkyScan benchtop system features high-speed X-ray microtomography
Published: March 20, 2017
Bruker, Billerica, Mass., introduces the SkyScan 1275, a high-speed X-ray microtomography benchtop system specially designed for fast scanning using new advances in the technology of X-ray sources and efficient flat-panel detectors.
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Materion acquires Heraeus target materials for its semiconductor and other markets
Published: March 19, 2017
Materion Corp., Mayfield Heights, Ohio, announces that it has acquired the target materials business of the Heraeus Group to strengthen its position in precious and non-precious target materials for the semiconductor, architectural and automotive glass, photovoltaic, and display markets.
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January 2017 semiconductor sales up 14 percent over January 2016
Published: March 16, 2017
The Semiconductor Industry Association, Washington, announces that worldwide sales of semiconductors reached $30.6 billion for the month of January 2017, an increase of 13.9% compared to the January 2016 total of $26.9 billion.
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Swiss researchers develop X-ray tomography for 3-D imaging of 34-nm transistor on a chip
Published: March 16, 2017
Researchers of the Paul Scherrer Institute in Switzerland have reportedly made detailed 3-D images of a commercially available computer chip, marking the first time a nondestructive method has visualized the paths of a chip's internal 45-nm-wide wiring and its 34-nm-high transistors clearly without distortions or deformations.
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