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1458 items found
Barcelona scientists bond chips to circuit boards with ink containing silver nanoparticles
Published: March 16, 2017
A team of researchers at the University of Barcelona has reportedly demonstrated a new bonding technique for surface mounted devices in which an inkjet printer with ink that incorporates silver nanoparticles bonds the devices.
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Nikon PCB inspection system features intuitive navigation of electronic devices
Published: March 16, 2017
Nikon Metrology, Brighton, Mich., introduces the XT V 160, a highly flexible and cost-effective electronics and semiconductor inspection system designed for production facilities and failure analysis laboratories.
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Kateeva doubles space to manufacture inkjet printing equipment for OLED displays
Published: March 12, 2017
Kateeva, Newark, Calif., is expanding its headquarters by leasing an adjacent building at its Newark campus to facilitate production ramp-up of its Yieldjet inkjet printing manufacturing equipment for the global flat panel display industry.
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Sandia develops kinetic deposition of ceramic nanoparticles to build thin films
Published: March 05, 2017
Sandia National Laboratories, Albuquerque, N.M., reports that its scientists have developed an aerosol deposition process in which ceramic nanoparticles form coatings when deposited at high speed at room temperature.
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Solar Manufacturing designs vacuum furnace to process mu-metal shields
Published: March 01, 2017
Solar Manufacturing, Souderton, Pa., has completed a new Model HFL-5772-EQ vacuum furnace specially designed by Solar for processing mu-metal shields at Magnetic Shields Ltd. for electronic applications.
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NSL acquires Perkin-Elmer ICP-MS for quick, accurate trace element analysis
Published: February 23, 2017
NSL Analytical Services Inc., Cleveland, Ohio, announces the acquisition of a PerkinElmer NexION 350 ICP-MS, which enables NSL to analyze virtually any sample for trace elements with fast and accurate results.
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Germanium outperforms silicon in low-voltage transistors with low power
Published: February 21, 2017
A team of scientists from the Nanoelectronic Materials Laboratory (NaMLab) and the Cluster of Excellence Center for Advancing Electronics Dresden at the Dresden University of Technology in Germany report that they have demonstrated the first germanium-based transistor that can be programmed between electron-(n) and hole-(p) conduction.
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Amkor acquires Nanium to strengthen its position in wafer-level packaging
Published: February 21, 2017
Amkor Technology Inc., Tempe, Ariz., has entered into a definitive agreement to acquire Nanium, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction were not disclosed.
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Intel to invest $7 billion in 7-nm semiconductor fab in Arizona
Published: February 21, 2017
Intel Corp., Santa Clara, Calif., plans to invest more than $7 billion to complete Fab 42, which is expected to be the most advanced semiconductor factory in the world.
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Worldwide semiconductor capital spending forecast to grow 2.9% in 2017
Published: February 21, 2017
Worldwide semiconductor capital spending is projected to increase by 2.9% in 2017, to $69.9 billion, according to Gartner Inc.
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