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1458 items found
Leica Microsystems announces education partnership with ASM International
Published: February 03, 2017
Leica Microsystems, Buffalo Grove, Ill, announces a new educational partnership with ASM International, the preeminent association for connecting materials professionals with the finest resources available – to solve problems, improve materials performance, and support professional development.
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Asylum Research develops full-featured video-rate atomic force microscope
Published: February 03, 2017
Oxford Instruments Asylum Research, Goleta, Calif., announces the new Cypher VRS Video-Rate AFM, said to be the first and only full-featured video-rate atomic force microscope.
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Bruker acquires Hysitron for its nanomechanical testing instruments
Published: January 27, 2017
Bruker, Billerica, Mass., announces that it has acquired Hysitron Inc., a technology leader in the development, manufacture, and sale of nanomechanical test instrumentation.
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Illinois team advances GaN-on-silicon for scalable high electron mobility transistors
Published: January 22, 2017
A team of researchers at the University of Illinois at Urbana-Champaign has advanced gallium nitride (GaN)-on-silicon transistor technology by optimizing the composition of the semiconductor layers that make up the device.
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Beta gallium oxide experimental transistor demonstrates ultra-wide bandgap
Published: January 22, 2017
Purdue University, West Lafayette, Ind., reports that its researchers have demonstrated the high-performance potential of an experimental transistor made of beta gallium oxide, which could bring new ultra-efficient switches for applications such as the power grid, military ships, and aircraft.
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Imec and EV Group achieve 1.8µm accuracy in pitch overlay for wafer bonding
Published: January 22, 2017
Imec, Belgium, and EV Group, Tempe, Ariz., announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding.
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Compact mechanical test system fits inside scanning electron microscopes
Published: January 22, 2017
MTI Instruments, Albany, N.Y., introduces the MTII/Fullam SEMtester compact mechanical test system, which is specifically designed to fit inside scanning electron microscopes.
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Malvern and Panalytical merge to grow materials analysis business
Published: January 22, 2017
Malvern Instruments, England, and Panalytical, The Netherlands, announce that on January 1 they merged their activities to grow the materials characterization business within the Materials Analysis segment of parent company Spectris.
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Optical microscopy/laser spectroscopy instrument identifies micron-size particles
Published: January 22, 2017
Researchers at the Massachusetts Institute of Technology's Lincoln Laboratory, Cambridge, report that they have developed a microscope in which optical microscopy is combined with laser spectroscopy to enable identification of individual micron-sized particles.
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Semiconductor assembly/testing services poised for steady growth
Published: January 22, 2017
Future Market Insights (FMI), Valley Cottage, N.Y., releases its latest report on the semiconductor assembly and testing services market, predicting that it will primarily be driven by the surging demand for high-end packaging solutions.
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