Aehr receives first order for Fox-XP test and burn-in system

Published: October 17, 2015

Aehr Test Systems, Fremont, Calif., has received its first order for its Fox-XP wafer level test and burn-in system, including multiple Fox-XP WaferPak contactors and application development services.

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Bruker to acquire Jordan Valley Semiconductors Ltd. for X-ray metrology

Published: October 17, 2015

Bruker Corp., Billerica, Mass., announces that it is to acquire the shares of Jordan Valley Semiconductors Ltd. for its innovative in-line X-ray metrology products, which complement Bruker's leading position in analytical X-ray technologies.

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1366 Technologies to build Direct Wafer manufacturing plant in New York

Published: October 17, 2015

1366 Technologies, Bedford, Mass., announces plans to build a state-of-the-art, commercial solar wafer manufacturing facility in Genesee County, New York, strategically located between Buffalo and Rochester.

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DCG Systems’ Meridian M designed for static optical failure analysis of wafers

Published: October 17, 2015

DCG Systems, Fremont, Calif., has released the Meridian M system for isolation of both routine and challenging electrical faults at the wafer level.

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Transistors cooled by water flowing through microfluidic passages in chips

Published: October 17, 2015

Georgia Institute of Technology, Atlanta, reports that its researchers have developed a technology for cooling transistors that is based on de-ionized water flowing through microfluidic passages.

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ASM International elects new president, vice president, treasurer, and trustees

Published: October 15, 2015

ASM International, Materials Park, Ohio, elected Jon D. Tirpak, PE, FASM, as ASM's 2015-2016 Board of Trustees President.

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New machining capability is efficient and cost-effective

Published: October 08, 2015

Norman Noble Inc., Cleveland, Ohio, introduces SynchroFlash, a new machining capability that synchronizes Swiss turning and milling and laser machining into one, highly efficient and cost- effective operation.

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RIT chosen to lead university-industry consortium to advance additive manufacturing

Published: October 02, 2015

Rochester Institute of Technology, Rochester, N.Y., announces that it has been chosen to lead a consortium of universities and corporations in establishing a New York State Center for advanced technology in additive manufacturing and functional printing.

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Advancing development of thermal manufacturing technologies

Published: September 24, 2015

Cross-industry Consortium Leads the Way to Advanced Thermal Manufacturing

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Suss MicroTec launches semi-automated high-force wafer bonder

Published: September 18, 2015

Suss MicroTec, Germany, introduces the XB8 semi-automated wafer bonding platform, which supports substrates with a wafer size of up to 200 mm.

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