Macom announces milestone in the commercialization of GaN on silicon technology

Published: September 18, 2015

Macom Technology Solutions Inc., Lowell, Mass., reports that it has shipped more than one million GaN-on-Silicon (GaN on Si) RF power devices to date for communications, military, and other RF applications.

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JEOL introduces entry level Field Emission SEM with ultrahigh spatial resolution

Published: September 18, 2015

Jeol USA, Peabody, Mass., introduces the new JSM-7200F FE SEM with ultrahigh spatial resolution of 1.6 nm at 1.0 kV, and high probe current of 300 nA.

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Global Foundries launches 22FDX semiconductor technology for ultralow-power devices

Published: September 17, 2015

Global Foundries, Santa Clara, Calif., has launched a new semiconductor technology developed specifically to meet the ultralow-power requirements of the next generation of connected devices.

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XFlash FlatQuad SDD enables high vacuum and low beam-current EDS analysis

Published: September 17, 2015

Bruker Nano Analytics, Madison, Wis., has developed XFlash FlatQuad, a side-entry silicon drift detector positioned between the SEM pole piece and sample.

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Zeiss hardware/software package streamlines image acquisition and extends capacity of SEMs

Published: September 17, 2015

Zeiss, Pleasanton, Calif., introduces the Zeiss Atlas 5, a powerful hardware and software package that extends the capacity of its scanning electron microscopes (SEM) and focused ion beam SEMs (FIB-SEM).

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Austria’s AMS to invest $2 billion in new fab in New York state

Published: September 17, 2015

AMS AG, Austria, formerly Austriamicrosystem, plans to locate a new 360,000 sq. ft. fab in upstate New York at the Nano Utica site in Marcy to manufacture analog devices on 200/300 mm wafers.

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DOD awards $75 million to FlexTech Alliance for flexible hybrid electronics

Published: September 17, 2015

FlexTech Alliance, San Jose, Calif., announces that the U.S. Department of Defense has awarded it $75 million over five years in a Cooperative Agreement to establish and manage a Manufacturing Innovation Institute (MII) for Flexible Hybrid Electronics (FHE MII).

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Rice and Penn State open center for development of 2-D coatings

Published: August 30, 2015

Rice University, Houston, and Pennsylvania State University, University Park, announce that scientists at a new research center will study, in collaboration with industry, the development of atom-thin two-dimensional coatings.

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Progressive Surface installs suspension plasma spray systems for semiconductor coatings

Published: August 30, 2015

Progressive Surface, Grand Rapids, Mich., recently installed three 100HE plasma spray systems for the semiconductor industry.

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DOD awards $75 million to FlexTech Alliance for flexible hybrid electronics manufacturing

Published: August 28, 2015

FlexTech Alliance, San Jose, Calif., announces that the U.S. Department of Defense has awarded it $75 million over five years in a Cooperative Agreement to establish and manage a Manufacturing Innovation Institute for Flexible Hybrid Electronics.

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