Utitec expands heat treating capabilities with Ipsen Titan furnace

Published: August 16, 2015

Ipsen, Cherry Valley, Ill., announces that it recently shipped a Titan vacuum furnace to Utitec's facility in Watertown, Conn.

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Imec expands R&D of GaN-on-silicon technology for power devices to speed industrialization

Published: August 16, 2015

Imec Nano-Electronics Research Center, Belgium, is extending its gallium nitride-on-silicon (GaN-on-Si) R&D program.

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Hitachi NX9000 enables real-time 3D structural analysis

Published: August 15, 2015

Hitachi High-Technologies Corp., Japan, has released the NX9000 real-time 3D analytical FIB 1-SEM 2 composite instrument.

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Amkor to invest $60 million in China to expand assembly and test facility

Published: August 15, 2015

Amkor Technology Inc., Tempe, Ariz., announces plans to invest $60 million to expand its state-of-the-art assembly and test factory located in China's Shanghai Waigaoqiao Free Trade Zone.

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Hybrid instrument combines photonic-nanomechanical force microscopy and nanospectroscopy

Published: August 14, 2015

A microscope being developed at the Department of Energy's Oak Ridge National Laboratory in Tennessee will allow scientists studying biological and synthetic materials to simultaneously observe chemical and physical properties on and beneath the surface.

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Oxford Instruments launches silicon drift detector with ultrahigh resolution at low kV

Published: August 14, 2015

Oxford Instruments, U.K., has launched X-Max Extreme, a silicon drift detector for ultrahigh resolution FEG and FIB-SEM applications.

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University of Arkansas to develop circuit simulation model for GaN devices

Published: August 14, 2015

Researchers at the University of Arkansas, Fayetteville, have received a $200,000 grant to study the modeling of gallium nitride devices.

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Applied Materials introduces high-performance ALD technology for 3D thin film devices

Published: August 11, 2015

Applied Materials Inc., Santa Clara, introduces the Applied Olympia ALD (atomic layer deposition) system featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.

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Materion doubles capacity for ToughMet CuNiSn alloys

Published: August 11, 2015

Materion Performance Alloys, Mayfield Heights, Ohio, has more than doubled its capacity to produce foil gauge ToughMet alloys that are used to make the company's BrushForm 158 copper-nickel-tin alloy strip product line.

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Black phosphorus may replace silicon in future devices

Published: August 11, 2015

Researchers at the Center for Integrated Nanostructure Physics at Sungkyunkwan University, South Korea, report that they have developed a high-performance transistor made of black phosphorus (BP).

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