Chinese company to bid for Micron Technology

Published: August 11, 2015

China's state-owned Tsinghua Unigroup Ltd. is preparing a $23 billion bid for chipmaker Micron Technology, San Diego, in what some say would be the biggest Chinese takeover of a U.S. company.

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Rohm acquires Powervation for its Intelligent Digital Power platform

Published: August 11, 2015

Rohm Co. Ltd., Japan, announces that it has completed the acquisition of Powervation Ltd., Cork, Ireland.

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Aluminum could boost lithium-ion battery power

Published: August 06, 2015

One big problem faced by electrodes in rechargeable batteries, as they go through repeated cycles of charging and discharging, is that they must expand and shrink during each cycle—sometimes doubling in volume then shrinking back.

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Technical program announced for ISTFA 2015

Published: August 06, 2015

ISTFA 2015, November 1-5 in Portland, Ore., features over 22 technical sessions, 106 presentations, four user groups, and 18 tutorials on the latest research and developments in the field of electronic device failure analysis

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NIST hosts first app challenge to improve data access

Published: July 30, 2015

Researchers looking for information on the properties of methane at high temperatures or the isotopic composition of an element know they can rely on standard reference data from NIST.

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3D white graphene could keep electronics cool

Published: July 22, 2015

3D structures of boron nitride might be the right stuff to keep small electronics cool.

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Jeol FE SEM features super hybrid lens design for high resolution imaging

Published: July 10, 2015

Jeol USA, Peabody, Mass., introduces the 7000 series of Field Emission Scanning Electron Microscopes with ultrahigh resolution and low-kV/low-vacuum operation for imaging and nano-analysis of structures, surface details, and magnetic samples.

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Cadence and Applied Materials collaborate to optimize planarization process

Published: July 09, 2015

Cadence Design Systems Inc., San Jose, Calif., and Applied Materials Inc., Santa Clara, Calif., are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nm and below.

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Oxford Instruments launches EBSD detector with speed of 1580 points per second

Published: July 09, 2015

Oxford Instruments, U.K., has launched NordlysMax3, an EBSD detector that acquires indexes and displays results at 1580 points per second.

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National Instruments Semiconductor Test Systems feature PXI modular instrumentation

Published: July 09, 2015

National Instruments, Austin, Texas, introduces its Semiconductor Test Systems (STS), which feature PXI modular instrumentation and open system design software for semiconductor test environments.

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