Micro-reactor produces silver nanoparticles at room temperature for printed circuits

Published: July 09, 2015

Engineers at Oregon State University, Corvallis, report that they have invented a way to fabricate silver nanoparticles that are produced at room temperature for printed electronics.

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SPP Technologies to acquire Orbotech’s SPTS Technologies Thermal Products business

Published: July 09, 2015

Orbotech Ltd., Israel, announces that SPTS Technologies Group (SPTS), U.K., an Orbotech company and supplier of advanced wafer processing solutions, has sold its Thermal Products business to SPP Technologies Co. (SPT), a subsidiary of Sumitomo Precision Products Co.

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Nordson March plasma treatment systems designed for packaging applications

Published: July 09, 2015

Nordson March, Concord, Calif., announces its new Sphere Series plasma treatment systems for wafer-level and 3D packaging applications.

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Photo-doping of semiconductor enables formation of new material phases

Published: July 09, 2015

Researchers at Michigan State University, East Lansing, report that by shooting an ultrafast laser pulse into a semiconductor, its properties change as if it had been chemically doped.

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Dense yttrium oxide coats electronic devices via suspension plasma spray

Published: July 09, 2015

Progressive Surface, Grand Rapids, Mich., recently installed three 100HE plasma spray systems in a semiconductor manufacturing facility.

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Picosun ALD technology enables uniform gold films on silicon wafers

Published: July 09, 2015

Picosun Oy, Finland, and Carleton University, Ottawa, have collaborated to develop a process in which atomic layer deposition (ALD) technology deposits thin uniform gold films on complete silicon wafers.

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Ultra 76 Plus tantalum alloy resists corrosion in hot concentrated acids

Published: July 08, 2015

H.C. Starck, Newton, Mass., introduces the Ultra 76 Plus tantalum alloy, which is designed to combat aggressive hazardous-chemical corrosion in hot concentrated acids.

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SEMI reports fabs are expected to grow spending

Published: June 22, 2015

SEMI, San Jose, Calif., has published its May update to the World Fab Forecast, reporting on more than 200 facilities with equipment spending in 2015, and more than 175 facilities projected to spend in 2016.

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New process enables quick separation of neodymium and dysprosium

Published: June 20, 2015

Researchers at the University of Pennsylvania, Philadelphia, have reportedly developed a process that could enable the efficient recycling of two rare earth metals, neodymium and dysprosium.

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Calibre PERC platform chosen for reliability verification by Intel Custom Foundry

Published: June 19, 2015

Mentor Graphics Corp., Wilsonville, Ore., announces that Intel Custom Foundry is expanding its 14nm platform offering to include reliability verification based on the Calibre PERC platform for its customers.

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