Samsung Electronics begins mass production of semiconductors at South Korean facility

Published: February 24, 2020

Samsung Electronics Co. Ltd., South Korea, announces that its South Korean facility has begun its first semiconductor mass production line dedicated to the extreme ultraviolet (EUV) lithography technology and to production of chips using a process node of 7 nanometer (nm) and below.

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EDAX introducing the Clarity EBSD detector based on direct electron detection technology

Published: February 24, 2020

EDAX, Mahwah, N.J., is planning to release the Clarity electron backscatter diffraction (EBSD) detector, the world’s first commercial EBSD-specific detector based on direct electron detection technology.

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Jeol USA introduces field emission SEM featuring NeoEngine analytical intelligence

Published: February 24, 2020

Jeol USA, Peabody, Mass., introduces a new field emission scanning electron microscope with several features unique to the company’s FE SEM product line.

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SEMI and VLSI Research to publish semiconductor manufacturing industry report

Published: February 23, 2020

SEMI, Milpitas, Calif.; and VLSI Research, San Jose, Calif., announce that they will publish Semiconductor Manufacturing Monitor, a report covering the semiconductor manufacturing industry from materials to electronic systems.

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IBM and Hamamatsu develop prototype of scanning time-resolved emission system

Published: February 22, 2020

Researchers from IBM Research and Hamamatsu Photonics discussed the first prototype of a scanning time-resolved emission (STRE) system at the ASM International ISTFA 2019 conference in Portland, Oregon.

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Chip Targets acquires first US MIP decapsulation tool for chip failure analysis

Published: February 22, 2020

Chip Targets, Richardson, Texas, announces that it has increased its range of failure analysis service capabilities to include an atmospheric microwave induced plasma (MIP) decapsulation instrument from Jiaco Instruments of Delft, the Netherlands.

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IC Insights report covers semiconductor wafer capacity of five major manufacturers

Published: February 21, 2020

IC Insights, Scottsdale, Ariz., recently released its “Global Wafer Capacity 2020-2024” report that features detailed profiles of the five companies with the greatest fab capacity, and includes a ranking of the 25 largest wafer-capacity leaders in terms of monthly installed capacity.

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Lock-In Thermography enables failure analysis of resistive opens and electrical shorts

Published: February 20, 2020

Researchers from Advanced Micro Devices, Thermo Fisher Scientific, and the Fraunhofer Institute for Microstructure of Materials and Systems IMWS, presented a discussion of “Lock-In Thermography” (LIT) at the ASM International ISTFA 2019 conference in Portland, Oregon.

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Argonne molecular layer etching tool enables precise control of thin film materials

Published: February 20, 2020

Researchers at the U.S. Department of Energy's Argonne National Laboratory, Chicago, have developed a new etching technique that could potentially help make small but complex semiconductors.

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Markforged releases pure copper for printing complex components on its Metal X 3D printer

Published: February 20, 2020

Markforged, Watertown, Mass., announces the release of pure copper for its Metal X 3D system, making it easy to consistently create complex parts with high electrical and thermal conductivity.

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