Amkor Technology completes acquisition of Nanium for its semiconductor packaging

Published: June 18, 2017

Amkor Technology Inc., Tempe, Ariz., has completed the acquisition of Nanium S.A., Portugal, a provider of wafer-level fan-out semiconductor packaging solutions.

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Optical silicone binder extends thermal stability to >180°C for chip-scale LED packaging

Published: June 18, 2017

Dow Corning, Midland, Mich., introduces Dow Corning CL-1000 optical silicone binder, a new, more thermally stable, high-refractive-index material that is formulated to expand design options for high-power chip-scale LED packaging (CSP).

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IBM technology for building transistors from silicon nanosheets will enable 5nm chips

Published: June 18, 2017

IBM, Armonk, N.Y., announces the development of the first industry process for building silicon nanosheet transistors that will enable 5nm chips.

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Global semiconductor sales increase by 21% year-to-year in April

Published: June 18, 2017

The Semiconductor Industry Association, Washington, D.C., reports that worldwide sales of semiconductors reached $31.3 billion for the month of April 2017, an increase of 20.9 percent from the April 2016 total of $25.9 billion, and 1.3 percent more than the March total of $30.9 billion.

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Superelasticity measured on nanometer pillars of Cu-Ni-Al shape-memory alloy

Published: June 12, 2017

UPV/EHU-University of the Basque Country, Spain, announces that its researchers have explored superelasticity properties on a nanometer scale based on shearing a Cu-14Al-4Ni shape-memory alloy's pillars down to nanometric size.

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Germanium extracted from ore by injecting organic molecules and shaking milling jars

Published: June 12, 2017

McGill University, Montreal, announces that a team of chemists has developed a way to process metals with organic molecules, instead of chlorine and hydrochloric acid, to help purify germanium.

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University in England completes $4.5 million TEM microscope and ion accelerator

Published: May 30, 2017

The University of Huddersfield, England, announces the completion of a $4.5 million research facility that includes a transmission electron microscope and a dual-beam ion beam accelerator.

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Anton Paar Revetest3 coating scratch tester enables automatic detection of critical loads

Published: May 23, 2017

Anton Paar USA, Ashland, Va., presents the third generation of the Revetest scratch tester, the RST3, the only scratch tester on the market that features automatic detection of critical loads.

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Barium-tin-oxide transparent thin film could improve electronics and solar cells

Published: May 22, 2017

The University of Minnesota, Minneapolis, announces that a team of researchers has developed a barium-tin-oxide transparent highly conductive thin film in which they replaced elemental tin with a chemical precursor of tin.

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Ultratech dual-beam laser spike anneal systems to treat FinFET for 10-nm nodes

Published: May 21, 2017

Ultratech Inc., San Jose, Calif., announces that it has received a multiple system follow-on order for its LSA101 dual-beam laser spike anneal systems for expansion of 10-nm FinFET production.

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