Silicon wafer fanout technology enables dense network of memory interface vias

Published: December 18, 2016

Amkor Technology Inc., Tempe, Ariz., announces completion of product qualification for its innovative silicon wafer integrated fan-out technology, which is designed to handle the demanding requirements of today's advanced mobile, networking, and system-in-package applications.

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Bruker XRD instrument designed to analyze epitaxial/polycrystalline thin films

Published: December 18, 2016

Bruker AXS, Billerica, Mass., introduces the D8 Advance Plus as the newest member of the D8 Advance family of X-ray diffraction (XRD) solutions.

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Silicon-passivated germanium nMOS gate stack has reduced interface defect density

Published: December 18, 2016

Imec, Belgium, has shown for the first time that a silicon-passivated germanium nMOS gate stack with reduced interface defect density reaches the same defect level as a silicon gate stack, and has high mobility with reduced positive bias temperature instability.

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New method allows study of individual defects in transistors

Published: December 18, 2016

University of Twente, Netherlands, reports that scientists from its MESA+ research institute have developed a method for studying individual defects in transistors.

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Global Wafers acquires SunEdison for its product development capabilities

Published: December 18, 2016

Global Wafers Co. Ltd., Taiwan, announces that its acquisition of SunEdison Semiconductor, St. Peters, Mo., has been successfully completed.

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Lincoln Lab wins Herschel Award for digital-pixel readout integrated circuits

Published: December 18, 2016

The Massachusetts Institute of Technology, Cambridge, announces that the MIT Lincoln Laboratory was presented with the Herschel Award at the recent 2016 Military Sensing Symposia Detectors and Materials Conference for its development of digital-pixel readout integrated circuits.

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Semiconductor equipment sales forecast to reach $40 billion in 2016

Published: December 16, 2016

SEMI, San Jose, Calif., says that worldwide sales of new semiconductor manufacturing equipment will increase by 8.7% to $39.7 billion in 2016, according to its year-end forecast.

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Zeiss automated digital microscope combines three functions into a single module

Published: November 26, 2016

Carl Zeiss, Germany, offers the Smartzoom 5 optical digital microscope in which three functions (zoom, overview camera, and coaxial illumination) are combined in a single optical engine.

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Microscope camera provides intelligent real-time and fluorescence imaging

Published: November 26, 2016

Olympus, Japan, introduces the DP74 color fluorescence microscope camera, which combines advanced image processing technology, a low-noise design, and easy-to-use software to deliver smooth, true-to-life images in demanding industrial applications.

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NIST releases “Fractography of Ceramics and Glasses” to facilitate failure analysis

Published: November 26, 2016

NIST, Gaithersburg, Md., has released a new and expanded edition of the NIST Recommended Practice Guide, "Fractography of Ceramics and Glasses" (NIST Special Publication 960-16e2), developed to help engineers and scientists analyze the patterns in fractures of ceramics and glasses.

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