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Nikon advanced 2D/3D x-ray methods enable failure analysis of electronic devices

Researchers from Nikon Metrology, Brighton, Mich., at ISTFA 2019 will present a discussion of modern 2D and 3D x-ray-based approaches for testing and failure analysis, and describe how these different methods have practical application for failure analysis and dimensional metrology. These advanced technologies are among the most useful nondestructive testing methods that enable the inspection of an object’s internal features without cutting or disassembling the sample.

 

Some of the techniques that can be used for NDT include radiography, laminography, computed tomography, limited angle tomography, and computed laminography. They can be of assistance in the determination of voids/porosity, flaws, cracks, and inclusions within manufactured parts from the electronics industry.

 

As the global manufacturing industry continues to grow and require top tier safety and quality standards, x-ray technologies and techniques provide the visualization and metrology analysis necessary to meet those demands.

 

Title: “Modern 2D & 3D X-ray technologies for testing and failure analysis”

 

Authors: Dr. Herminso Villaraga-Gómez, Mr. Joshua Bell, Master in Physics, Nikon Metrology, Inc., Brighton, Michigan

 

https://www.asminternational.org/web/istfa-2019/home

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