Ultratech Inc., San Jose, Calif., introduces the Superfast 4G+ in-line 3D topography wafer inspection system featuring coherent gradient sensing technology that reportedly enables a single wafer inspection tool to measure patterned wafers across the entire fab line at low cost. The system builds on the field leadership of the Superfast 4G, which currently provides the industry’s highest-productivity and lowest-cost solution for high-volume manufacturing. Ultratech plans to begin shipping the Superfast 4G+ systems in the first quarter of 2016.
The system features include direct, front-side 3D topography measurement for opaque and transparent stacks of patterned wafers; 150 wph, the highest industry 3D in-line inspection throughput with the smallest footprint; one-mm edge exclusion, enabling full-wafer pattern inspection and thin-film 3D process control; and large-bow option for in-line manufacturing control of highly bowed wafers without impacting throughput.
The direct, front-side 3D topography measurement capability is well-suited for patterned wafer applications such as lithography feed-forward overlay distortion and edge-defocus control, as well as thin-film deposition stress and planarization control. Delivering a 2X improvement in performance with fleet matching TMU (Total Measurement Uncertainty), along with the ability to measure opaque and transparent stacks on patterned wafers, the Superfast 4G+ provides cost-effective technology to address the critical needs of its global customers. In addition, leveraging the same breakthrough CGS optical module, the Superfast 4G+ is available as a field upgrade of the Superfast 4G.
“Our current leadership position in in-line 3D inspection at advanced memory and foundry manufacturers with Superfast 4G has provided us with a tremendous learning environment,” says Damon Tsai, Ultratech Asia Director for Inspection Systems. “Our partners have helped us develop new hardware capabilities like the ‘Recipe Driven Range Control,’ an innovative high-throughput, large-bow optical option on board the Superfast 4G+, as well as new fleet management performance metrics. The inherently simple design of the coherent gradient sensing (CGS) technology is enabling us to rapidly deliver new capabilities and performance improvements over more complex optical solutions.”
