Amkor Technology Inc., Tempe, Ariz., has entered into a definitive agreement to acquire Nanium, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction were not disclosed.
The acquisition of Nanium will strengthen Amkor’s position in the fast-growing market of wafer-level packaging for smartphones, tablets and other applications. Naniujm has developed a high-yielding, reliable WLFO technology, and has successfully ramped that technology to high volume production. Nanium has shipped nearly one billion WLFO packages to date utilizing a state-of-the-art 300mm Wafer-Level Packaging (WLP) production line.
“This strategic acquisition will enhance Amkor’s position as one of the leading providers of WLP and WLFO packaging solutions,” said Steve Kelley, Amkor’s president and chief executive officer. “Building on Nanium’s proven technologies, we can expand the manufacturing scale and broaden the customer base for this technology.”
Nanium is based in Porto, Portugal, employs approximately 550 people, and had annual sales of approximately $40 million for the fiscal year ended September 30, 2016. The transaction is expected to close in the first quarter of 2017, subject to customary closing conditions and regulatory approvals.
