Zeiss, Pleasanton, Calif., introduces the Zeiss Xradia 620 Versa RepScan, a submicron-resolution, 3D nondestructive imaging solution for inspection and measurement that accelerates time to market for advanced IC packages.
The instrument includes the proven Versa 3D XRM capability, which images and measures buried features nondestructively with submicron resolution, and extracts critical 3D information based on reconstructed 3D data sets. It can perform both linear and volumetric measurements, as well as dimensional analysis of TSVs and microbumps, solder volumes and shapes, bond line thicknesses and die warpage, 3D void analysis, and other measurements of interest with minimal need for sample preparation.
Utilizing 3D X-ray microscopy (XRM) with Zeiss’s revolutionary Resolution at a Distance (RaaD) technology and sophisticated analytical software, the instrument provides rich volumetric and linear measurements of buried features in the most advanced packages. These results cannot be achieved with existing methods, such as physical cross-section, 2D X-ray, or microCT. The result is higher-accuracy engineering data that can help to reduce development time and yield learning cycles of advanced packages.
The 620 Versa RepScan supports design verification, product development, process optimization, and quality assurance/control (QA/QC) of complex fine-pitch 3D architectures. Thses include 2.5D interposers, high-bandwidth memory stacks with through silicon vias (TSVs) and microbumps, package-on-package interconnects, and ultra-thin memory with multiple chips in a stack.
The semi-automated workflow provides repeatable measurements, which ensures that no images are lost due to cross-sectioning errors, and minimizes measurement variability inherent in manual techniques.
