IBM Japan Ltd. and Panasonic Smart Factory Solutions Co. Ltd., announce that the companies have agreed to collaborate to develop and market a new high-value-added system to optimize the overall equipment effectiveness of semiconductor manufacturing processes and to achieve high-quality manufacturing.
As part of its circuit formation process business, Panasonic currently develops and markets edge devices and manufacturing methods that contribute to improving semiconductor manufacturing of advanced packaging. These new devices and methods include dry etching equipment, plasma dicers to produce high-quality wafers, plasma cleaners that increase metal and resin adhesion, and high-accuracy bonding devices.
This expertise will be combined with techniques and technology that IBM Japan has developed for semiconductor manufacturing to help Panasonic create smart factory technology. These include data analysis systems such as advanced process control (APC) and fault detection and classification (FDC), as well as an upper-layer manufacturing execution system (MES). These advances will improve quality and automate production management in semiconductor manufacturing processes.
https://www.panasonic.com/jp/company/psfs/en.html
