Researchers from Sigray Inc., Concord, Calif., will discuss at ISTFA 2019 that new heterogeneous integration schemes and continuing miniaturization of packaging components such as micropillars are driving demand for new substantive changes to conventional failure analysis.
In particular, desired performance capabilities include the ability to nondestructively determine failures within seconds to minutes. Moreover, the process should be quantitative, capable of measuring 3D structures and buried structures, and have sufficient resolution to determine failures in <10-20 um features.
In this paper they present a novel solution based on x-ray chemical microscopy.
Title: “Novel x-ray microscopic chemical imaging for rapid non-destructive identification of microbump voids and compositional defects”
Mr. S.H. Lau, Dr. Benjamin Stripe, Ms. Sylvia Lewis, Ms. Xiaolin Yang, Dr. Wenbing Yun, Sigray Inc., Concord, California
https://www.asminternational.org/web/istfa-2019/home
