ClassOne Technology, Kalispell, Mont., has launched its Solstice line of electroplating tools designed specifically for 100 to 200-mm substrates.
ClassOne electroplating tool designed for 100 to 200-mm substrates
SUSS MicroTec launches ELD 300 excimer laser debonder for 3D integration
SÜSS MicroTec, Germany, has launched an excimer laser debonder, the ELD300, for the stress-free debonding of 200 and 300-mm 3D-IC wafers.
Power Electronics Manufacturing Consortium to develop silicon carbide electronic devices
New York State and more than 100 companies, led by General Electric, Schenectady, N.Y., will collaborate to launch the New York Power Electronics Manufacturing Consortium at the SUNY College of Nanoscale Science and Engineering in Albany.
AFM with automated defect review of bare wafers increases production throughput by 1000%
Park Systems, Santa Clara, Calif., announces Park NX-Wafer, an AFM designed for bare wafer manufacturing that fully automates the automatic defect review process.
Bruker SPM system incorporates infrared mode for nanoscale mapping
Bruker Nano Surfaces Division, Tucson, Ariz., announces the release of Inspire, the first integrated scanning probe microscopy infrared system for 10-nm spatial resolution in chemical and materials property mapping.