Applied Materials Inc., Santa Clara, Calif., introduces the Applied Endura Cirrus HTX PVD titanium nitride hardmask system with advanced technology for patterning copper interconnects at 10 nm and beyond.
Imec, Belgium, and Lam Research Corp., Fremont, Calif., have reportedly developed a novel bottom-up cobalt prefill technique for vias and contacts for electronic chips.
The Agency for Science, Technology, and Research (A-Star), Singapore, reports that a laser-induced thermal cracking technology for cutting silicon wafers could streamline the production of smaller and more powerful microchips for electronic devices.
Researchers at the University of Illinois, Champaign, have reportedly developed heat-triggered self-destructing electronic devices.
Sematech, Albany, N.Y., and Exogenesis Corp., Billerica, Mass., have agreed to a strategic alliance to commercialize the Exogenesis Accelerated Neutral Atom Beam (ANAB) process technology and the nAccel accelerated particle beam equipment platform.
