Park Systems, Santa Clara, Calif., introduces the NX-Hivac AFM system for semiconductor failure analysis.
High-vacuum SSRM AFM system designed for semiconductor failure analysis
Silver sinter paste for power semiconductors has strong adhesion to copper
Kyocera America Inc., San Diego, announces the U.S. introduction of its XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver higher performance than high-lead solders.
Titanium nitride hardmask system enables patterning copper interconnects at 10 nm
Applied Materials Inc., Santa Clara, Calif., introduces the Applied Endura Cirrus HTX PVD titanium nitride hardmask system with advanced technology for patterning copper interconnects at 10 nm and beyond.
Electroless deposition of cobalt enables void-free filling of vias for electronic chips
Imec, Belgium, and Lam Research Corp., Fremont, Calif., have reportedly developed a novel bottom-up cobalt prefill technique for vias and contacts for electronic chips.
Laser-induced thermal cracking speeds production of silicon chips
The Agency for Science, Technology, and Research (A-Star), Singapore, reports that a laser-induced thermal cracking technology for cutting silicon wafers could streamline the production of smaller and more powerful microchips for electronic devices.