Scientists in South Korea made ultra-thin photovoltaics flexible enough to wrap around the average pencil. The bendy solar cells could power wearable electronics like fitness trackers and smart glasses.
SEMI, San Jose, Calif., announces that 19 new fabs and lines are forecast to begin construction in 2016 and 2017, according to the latest update of the SEMI World Fab Forecast report.
FEI Co., Hillsboro, Ore., introduces three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing: the Helios G4 DualBeam EXL, The Metrios DX TEM, and the ExSolve 2 WTP.
Thermo Fisher Scientific Inc., Waltham, Mass., announces that it is to acquire FEI Co., Hillsboro, Ore., for approximately $4.2 billion.
Picosun Oy, Finland, has developed atomic layer deposition (ALD) equipment specifically designed for large-area flexible electronics encapsulation.
