Researchers of the Paul Scherrer Institute in Switzerland have reportedly made detailed 3-D images of a commercially available computer chip, marking the first time a nondestructive method has visualized the paths of a chip’s internal 45-nm-wide wiring and its 34-nm-high transistors clearly without distortions or deformations.

Kateeva, Newark, Calif., is expanding its headquarters by leasing an adjacent building at its Newark campus to facilitate production ramp-up of its Yieldjet inkjet printing manufacturing equipment for the global flat panel display industry.

The Semiconductor Industry Association (SIA), Washington, D.C., announces that the global semiconductor industry posted sales totaling $338.9 billion in 2016, the industry’s highest-ever annual sales and a modest increase of 1.1% over the 2015 total.

Global Foundries, Santa Clara, Calif., plans to expand its global manufacturing footprint by investing in its existing leading-edge fabs in the United States and Germany, expanding its footprint in China with a fab in Chengdu, and adding capacity for mainstream technologies in Singapore.

Qualcomm Inc., San Diego, Calif., and TDK Corp., Tokyo, announce the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE Ltd.

The University of California San Diego reports that its engineers have developed a thin, flexible, light-absorbing material that absorbs more than 87% of near-infrared light, with 98% absorption at 1550 nanometers, the wavelength for fiber optic communication.

IC Insights, Scottsdale, Ariz., recently released its new “Global Wafer Capacity 2016-2020” report showing that, as of December 2015, Taiwan is now the global leader in wafer capacity with nearly 22% of worldwide IC capacity installed in the country.