Dow Electronic Materials, Marlborough, Mass., announces availability of its Solderon BP TS 6000 tin-silver plating chemistry for lead-free solder bump plating applications. In copper pillar capping applications, it forms a smooth, micro-void free interface post reflow. It features enhanced plating performance, bath stability, and ease of use, thereby enabling the industry’s widest process window with the most robust process flexibility and a competitive cost of ownership.
Continue readingPeacock-colored polymer is flexible and thin
A synthetic material that mimics the brightest and most vivid colors in nature and changes color when twisted or stretched was developed by researchers at the University of Cambridge, UK. It could have important applications in the security, textile, and sensing industries. Instead of through pigments, these “polymer opals” get their color from their internal structure alone, resulting in pure color which does not run or fade.
Continue readingShape-memory polymer repeatedly reverses deformation
Researchers from the Institute of Biomaterial Science of the Helmholtz-Zentrum Geesthacht, Germany, have developed shape-memory polymers that can repeatedly change from one shape to another and then back again when temperatures fluctuate within a selected range. This enables their use as actuators. Until now, polymers with temperature-controlled shape memory could change form only once.
Continue readingVolume rendering on mobile devices
Bruker microCT (Kontich, Belgium) introduces a newly developed volume rendering application for mobile devices operating under iOS, such as iPad, iPhone and iPod Touch. It is now available as a free download on the App Store. Any 3D results obtained using SkyScan scanners can be sent to a mobile device for realistic visualization by real-time volume rendering with the possibility of 3D object manipulation, virtual cut, adjustments of object’s opacity and colors, etc.
Continue readingAzzurro sets volume production for GaN-on-Si high-voltage wafers
Azzurro Semiconductors, Germany, has successfully achieved superior electrical performance and established a volume production track record for large size high-voltage GaN-on-Si high-voltage wafers. Unlike silicon, which has inherent limitations for fast switching at high voltage, GaN can meet these performance requirements with its excellent breakdown voltage and low leakage characteristics. At present, the availability in the industry is still limited for production-suitable 6 in.
Continue readingUsing 3D to make materials stronger
Aided by funding from NASA and using methods similar to 3D printing, researchers at Missouri University of Science and Technology, Rolla, are running computer simulations of processes that could lead to stronger, more durable materials for the space agency. The researchers plan to fabricate some of these new materials soon, says Frank Liou, director of the Laser Aided Manufacturing Process (LAMP) Laboratory and the Michael and Joyce Bytnar professor of product innovation and creativity.
Continue reading27th ASM Heat Treating Society Conference Reports Strong Attendance and a Sold Out Expo Floor
The 27th ASM Heat Treating Society Conference and Exposition (Heat Treat 2013) concluded this week with a strong attendance from the Heat Treating community and a sold out crowd of exhibitors on the show floor. Heat Treat 2013 was held in Indianapolis at the downtown convention center September 16-18. The event attracted over 2000 people from the heat treating community, marking a 16% attendance increase from 2011 and 28% increase from 2009.
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