Mentor Graphics Corp., Wilsonville, Ore., has acquired Berkeley Design Automation Inc. (BDA), a recognized leader in nanometer analog, mixed-signal, and RF circuit verification.
Continue readingGeorgia Tech PRC and Finetech demonstrate copper Interconnects without solder
Finetech, Gilbert, Ariz., has been selected by the Georgia Tech Packaging Research Center (PRC), Atlanta, to provide its semi-automatic Matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine-pitch copper interconnect and assembly technology.
Continue readingBruker’s Vertex FTIR spectrometer covers complete mid and far infrared/THz ranges in one step
Bruker Corp., Madison, Wis., announces the world’s first FTIR spectrometer that covers the complete mid and far Infrared/THz spectral ranges in one step with no gaps.
Continue readingOxford Asylum’s MFP-3D Infinity AFM reduces XY sensor noise by 70%, Z-sensor noise by 85%
Oxford Instruments Asylum Research, Goleta, Calif., announces the new MFP-3D Infinity Atomic Force Microscope (AFM).
Continue readingErbium-antimony nanostructures manipulate light in the infrared range
Researchers at the University of California at Santa Barbara have developed an erbium-antimony semiconductor of nearly perfect quality that can manipulate light energy in the mid-infrared range.
Continue readingSuspension plasma spray with ceramic nanoparticles may triple service life of aircraft engines
Researchers at University West in Sweden have developed a technology in which ceramic nanoparticles are suspended in a liquid and then plasma-sprayed.
Continue readingLockheed Martin opens materials and thermal sciences R&D lab in Palo Alto
The Lockheed Martin Space Systems Advanced Technology Center, Palo Alto, has opened an Advanced Materials & Thermal Sciences Center for research and development.
Continue readingOxide nanosheets enable capacitance with 2000 times higher stability
Researchers at the Japan National Institute for Materials Science, International Center for Materials Nanoarchitectonics, and Shinshu University in Japan report that they have developed high-performance ultrathin capacitors.
Continue readingRhenium disulfide semiconductor bulk material acts like a 2D monolayer
Researchers at the Berkeley Lab Molecular Foundry report that they have developed rhenium disulfide, a semiconductor that functions electronically as if it were a 2D monolayer even as a 3D bulk material.
Continue readingNanotube paint reveals plane wing strain (with video)
Rice University scientists created a new paint they call “strain paint” and think it will help detect deformations in structures like airplane wings.
Continue readingPTFE/NanoDiamond coating doubles surface durability and reduces friction by up to 66%
Carbodeon, Helsinki, Finland, has released a new PTFE/NanoDiamond coating with twice the durability and up to 66% less friction than current products.
Continue readingBruker Fourier 60 FT-NMR spectrometer stabilizes temperature to ±0.1°C
Bruker Corp., Billerica, Mass., introduces the Fourier 60, an entirely new permanent-magnet based, benchtop FT-NMR (Fourier Transform Nuclear Magnetic Resonance) spectrometer.
Continue readingOxford Instruments acquires Andor
Oxford Instruments, U.K., recently acquired Andor, South Windsor, Conn., a market leading supplier of high performance cameras, microscope systems, and software for the physical science and life science industries.
Continue readingSUSS MicroTec and IBM to collaborate on excimer technologies for semiconductor packaging
SUSS MicroTec, Germany, announces the extension of a joint development agreement with the IBM Corporation to further develop, enhance, and propel the application of excimer laser technologies in the realm of advanced semiconductor packaging, including 3D systems integration.
Continue readingBrewer Science introduces CNT inks without surfactants
Brewer Science, Rolla, Mo., introduces CNTRENE 4010, the first aqueous, surfactant-free, ready-to-use semiconducting carbon nanotube inks for microelectronics and printed electronics applications.
Continue readingAurora Spine receives FDA clearance for its TiNano plasma spray coated spinal implants
Aurora Spine Corp., Carlsbad, Calif., announces that it has received U.S. Food and Drug Administration 510(k) clearance for sterile-packed titanium plasma spray coated (TiNano) spinal fusion implants.
Continue readingCadence Incisive 13.2 verification platform enables faster performance
Cadence Design Systems Inc., San Jose, Calif., introduces a faster version of the Incisive functional verification platform.
Continue readingImec celebrates 30 years of nanoelectronics industry innovation
Imec, Belgium, celebrates its 30th anniversary. Founded in 1984 as a non-profit organization, it has enabled notable advancements in global semiconductor chip manufacturing in the three decades since its founding.
Continue readingBruker stylus profiler enables 300-mm wafer analysis
Bruker Nanosurfaces Division, Billerica, Mass., introduces the Dektak XTL Stylus Profiler, extending its stylus profilometry capabilities to 200 and 300 mm semiconductor wafer fabs and next-generation touch panel manufacturers.
Continue readingMaking a mini Mona Lisa
Nanotechnique creates image 30 µm in width.
Continue readingTube TV technique images the nanoscale
Researchers working at the National Institute of Standards and Technology (NIST), Gaithersburg, Md., developed a new microscopy technique that uses a process similar to how an old tube television produces a picture-cathodoluminescence-to image nanoscale features. Combining the best features of optical and scanning electron microscopy, the fast, versatile, and high-resolution technique allows scientists to view surface and subsurface features potentially as small as 10 nm in size.
Continue readingSpark plasma sintering with rapid cooling enables higher strength and ductility
Researchers at the University of Rostock, Germany, have developed a new way to produce high strength metallic alloys at a lower cost and with less energy. Led by Dr. Eberhard Burkel, Professor of Physics, researchers demonstrated that rapidly cooling a material directly after spark plasma sintering (SPS) fabrication can enhance hardness, strength, and ductility. The new rapid cooling SPS system is based on a commercially available design, modified to include a series of gas inlet nozzles.
Continue readingMicroscopy movies capture material crystallization
Researchers from Lawrence Livermore National Laboratory, Calif., created movies of irreversible reactions that occur too rapidly to capture with conventional microscopy for the first time. The team used multi-frame, nanosecond-scale imaging in the dynamic transmission electron microscope (DTEM) to create movies of the crystallization of phase change materials used for optical and resistive memory.
Continue readingSulzer Metco laser cladding system applies deposits on multi-dimensional surfaces
Sulzer Metco, Switzerland, introduces MetcoClad, a robotics-based laser cladding system that can apply welded deposits on multi-dimensional surfaces in a single cladding run. The robust systems simplify operability, reduce production set-up time, and monitor the cladding process. Part manipulation can be tailored to customer requirements.
Continue readingDiamond powders encapsulated in metal increase life of diamond compacts
Powdermet Inc., Euclid, Ohio, offers DiaBond, a family of engineered diamond powders specially designed to improve bonding in metallic matrices, including nickel-, cobalt-, copper-, and aluminum-based binders. DiaBond powders are comprised of diamond grains encapsulated in a 1-20 micron coating of cobalt, nickel, chromium, chromium carbide, tungsten, tungsten carbide, copper, aluminum, silicon, or rhenium.
Continue readingUltra-thin threads of carbon nanotubes coated with diamond cut silicon wafers
The Fraunhofer Institute for Mechanics of Materials, Germany, together with colleagues from the Commonwealth Scientific and Industrial Research Organization (CSIRO), Australia, have developed a saw wire that can reduce kerf loss when cutting silicon wafers. In place of diamond-impregnated steel wires, the researchers use ultra-thin and extremely stable threads made of carbon nanotubes coated with diamond.
Continue readingTESCAN merges with Orsay Physics to form TESCAN-ORSAY
TESCAN (Brno, Czech Republic) a leading global supplier of scanning electron microscopes and focused ion beam workstations, and ORSAY PHYSICS, a world leader in customized focused ion beam and electron beam technology, have merged to form TESCAN-ORSAY HOLDING. Cooperating since 2007, Orsay Physics has been the sole supplier of ion beam technology to TESCAN.
Continue readingMaterion opens applications lab for sputter-coatings development and characterization
Materion Microelectronics & Services, a Materion Corporation business, Cleveland, Ohio, has opened a Materials Applications Laboratory in Westford, Mass. It will serve three functions: produce coatings for customer evaluations of PVD materials, promote customer education/collaboration, and support Materion internal R&D. The laboratory features thin film equipment, such as a sputtering system with a 150-mm diameter target, and an electron beam box coater.
Continue readingOlympus OmniScan SX phased-array portable flaw detector is smaller and lighter
Olympus America Inc., Center Valley, Pa., introduces the OmniScan SX, which is 33% lighter and 50% smaller than its predecessor. Featuring an easy-to-read 8.4-in. touch screen, the single group OmniScan SX provides a cost-effective solution for linear zero-degree inspections, such as corrosion mapping and composite inspection. It also enables weld inspection using one phased array group or one TOFD channel. The OmniScan SX comes in two models: the SX PA and SX UT.
Continue readingJournal of Thermal Spray Technology Special Issue on Nanocomposite Coatings: Call for Papers
Dr. Rehan Ahmed and Prof. Christopher C. Berndt will serve as Guest Editors for a special issue of the Journal of Thermal Spray Technology on the subject of “Development and Applications of Nanocomposite Coatings.” This issue will review and highlight the most recent advances in nanocomposite materials with special reference to thermal and cold spray processing.
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