Nanotechnology Archives - Page 14 of 16

Bruker launches NanoForce nanomechanical testing system

Bruker, Billerica, Mass., introduces the NanoForce nanoindenting and nanomechanical testing system.

Tungsten-chromium-iron PM alloy has hardness of 21 GPa

The Massachusetts Institute of Technology, Cambridge, announces that researchers have developed a tungsten-chromium-iron powder metallurgy alloy that could replace depleted uranium in armor-piercing projectiles.

GlobalFoundries and Invecas partner for design service centers

Global Foundries, Santa Clara, Calif., announces a partnership with Invecas Inc., also of Santa Clara, a newly formed design services provider focused on accelerating customer introduction of new products on leading-edge semiconductor process technologies.

Veeco MOCVD system incorporates single-wafer reactor technology

Veeco Instruments Inc., Plainview, N.Y., introduces the Propel Power Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system, which incorporates single-wafer reactor technology for outstanding film uniformity, yield, and device performance.

Nikon-JEOL form partnership to correlate light and electron microscopy

Nikon Instruments Inc., Melville, N.Y., and JEOL, Peabody, Mass., have formed a partnership to research and develop solutions to address correlative light and electron microscopy.

Applied Materials develops advanced patterning solution for memory devices

Applied Materials Inc., Santa Clara, Calif., announces that it has collaborated with Samsung Electronics Co. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

Imec, Coventor partner to advance CMOS process development

Imec, Belgium, has announced a joint development project with Coventor, Cary, N.C., that will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to Imec’s 10- and 7-nm processes.

GlobalFoundries to acquire IBM’s global semiconductor business

IBM, Armonk, N.Y., and GlobalFoundries, Santa Clara, Calif., today announced that they have signed a Definitive Agreement under which GlobalFoundries plans to acquire IBM’s global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics, subject to completion of applicable regulatory reviews.

Samsung to invest $14.7 billion in new semiconductor fab

Samsung Electronics, South Korea, announces plans to invest $14.7 billion in a new semiconductor fabrication facility in Pyeongtaek, South Korea to meet growing demand from smartphones, enterprise computing and the emerging “Internet of Things” market.

Brewer Science expands research for carbon-base materials at Missouri State

Brewer Science, Rolla, Mo., announces the completion of its largest expansion in the Springfield area, with the company gaining additional floor space at the Missouri State University’s Roy Blunt Jordan Valley Innovation Center.

Tescan introduces FIB-SEM workstation with 1.5 nm resolution, integrated Raman system

Tescan, Warrendale, Pa., introduces the new GAIA3 FIB-SEM workstation, which builds on the success of the Tescan Lyra FIB-SEM workstation.

Shimadzu EDXRF receives award for Analytical Instrument Industrial Design

Shimadzu North America, Columbia, Md., announces that its EDX-7000/8000 energy-dispersive X-ray fluorescence spectrometers won the 2014 IBO Gold Award for Analytical Instrument Industrial Design.

Jeol benchtop EDXRF provides elemental analysis with little or no sample prep

Jeol USA, Peabody, Mass., introduces the JSX-1000S ElementEye, an easy-to-use, smart solution for high-sensitivity elemental analysis in a new benchtop EDXRF spectrometer.

Software enables microspectrophotometers to make fast measurements of thin films

Craic Technologies, San Dimas, Calif., introduces Craic FilmPro film thickness measurement software.

DCG Systems Meridian probe enables full wafer diagnostic and testing under production conditions

DCG Systems Inc., Fremont, Calif., announces the first installation of the Meridian WS-DP (WaferScan Direct Probe) at Nvidia, a leading manufacturer of graphics processors for advanced visual computing.

Smallest known reference material for nanotechnology

If it’s true that good things come in small packages, then the National Institute of Standards and Technology (NIST), Gaithersburg, Md., can now make anyone working with nanoparticles very happy.

Smallest possible diamonds form ultra-thin nanothreads

For the first time, scientists have discovered how to produce ultra-thin “diamond nanothreads” that promise extraordinary properties, including strength and stiffness greater than that of today’s strongest nanotubes and polymers.

JEOL’s new NMR spectrometers feature compact size, improved performance

JEOL USA, Peabody, Mass., announces the JNM-ECZS series, a new line of next-generation NMR spectrometers that incorporate ultrahigh-accuracy RF circuitry based on the latest digital high-frequency technology.

Bruker Esprit Dynamics software enables high-resolution simulation of EBSD patterns

Bruker Nano Analytics, Hartford, Conn., has introduced ESPRIT DynamicS, a highly sophisticated and powerful software tool for the most realistic, high-resolution simulation of electron backscatter diffraction (EBSD) patterns.

Applied Materials introduces CVD and CMP systems for 3D architectures

Applied Materials Inc., Santa Clara, Calif., announces two new systems that help customers solve critical challenges in manufacturing high-performance, power-efficient 3D devices.

Intel announces new microarchitecture and 14-nm manufacturing process

Intel, Santa Clara, Calif., has released details of the Intel Core M processor, the first product to be manufactured using the optimized 14-nm manufacturing process.

Cameca launches next-generation atom probe microscope

Cameca, Paris, announces the release of the LEAP 5000, its latest-generation atom probe microscope, which offers unparalleled three-dimensional nanoscale surface, bulk, and interfacial materials analysis with atom-by-atom identification and accurate spatial positioning.

Porous silicon oxide enables high-density computer memory

Rice University, Houston, announces that its breakthrough silicon oxide technology for high-density, next-generation computer memory is one step closer to mass production, thanks to a refinement that will allow manufacturers to fabricate devices at room temperature with conventional production methods.