Braidy Industries Inc., Ashland, Ky., announces that it has acquired NanoAl LLC, a world leader in the science of nanocrystalline strengthening technology applied to sheet aluminum, as a third wholly owned subsidiary.
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Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, and Lawrence Livermore National Laboratory, Calif., announce that their researchers have developed a novel way to 3D print complex objects of graphene, the form of carbon that is one of the world’s strongest materials.
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Carnegie Mellon University, Pittsburgh, announces that its researchers have developed a copper-tin solder material that has twice the conductivity of conventional solders and a compliance higher by two to three orders of magnitude.
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Keyence, Itasca, Ill., introduces the XG-X Series customizable vision system with line scan camera support, which is designed to detect the smallest defects at high speeds not possible with area cameras.
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Bruker, Billerica, Mass., introduces the iProbe HRMAS, which provides full automation of high-resolution magic angle spinning (HRMAS) nuclear magnetic resonance.
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XJet Ltd., Israel, announces that it has received the Frost & Sullivan Technology Innovation Award for its NanoParticle Jetting (NPJ) technology for metal and ceramic additive manufacturing.
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The U.S. Army Research Laboratory (ARL) , Aberdeen Proving Ground, Md., announces that its researchers have developed a novel, structurally-stable, aluminum-base nanogalvanic alloy powder that reacts with water to produce hydrogen on-demand without a catalyst.
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Silverchair Information Systems, Charlottesville, Va., announces a partnership with ASM International, Cleveland, to develop a unified hosting solution for ASM’s authoritative materials information resources.
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Versum Materials Inc., Tempe, Ariz., a leading materials supplier to the semiconductor industry, announces the grand opening of its new R&D facility at its semiconductor materials manufacturing site in Hometown, Pennsylvania.
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Rigaku Corp., Japan, announces the release of the next-generation Rigaku SmartLab intelligent multipurpose x-ray diffractometer, which features the new PhotonMax high-flux 9 kW rotating anode x-ray source.
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JEOL USA, Peabody, Mass., announces the Grand Opening of the JEOL Center for Nanoscale Solutions at the University of California at Irvine, featuring the first U.S. installation of the JEOL Grand Arm Transmission Electron Microscope, which was developed for advanced atomic resolution characterization.
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Bruker, Billerica, Mass., has acquired Anasys Instruments Corp., a privately held company that develops and manufactures nanoscale infrared spectroscopy and thermal measurement instruments.
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This presentation from the Thermal Processing in Motion conference in June will discuss the enhancement of tribological surface properties and the thermal stability of nitrided layers made possible by a process in which plasma is doped with silicon-containing gasses, a technology known as Plasma Enhanced Nanostructures.
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Fudan University and the University of Science and Technology of China report that they have cured some forms of blindness by removing defective rods and cones in the retina of mice and replacing them with artificial rods and cones made of gold and titanium nanowires.
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Researchers at Oregon State University’s College of Engineering, Corvallis, have developed a conductive paste capable of 3D printing electronic circuits by mixing nickel nanoparticles into a galinstan alloy that is liquid at room temperature.
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Scientists at the Department of Energy’s SLAC National Accelerator Laboratory, Stanford, Calif., are using X-ray light to observe and understand how the process of making metal parts using 3D printing can leave flaws in the finished product.
Scientists at the Department of Energy’s SLAC National Accelerator Laboratory, Stanford, Calif., are using x-ray light to observe and understand how the process of making metal parts using 3D printing can leave flaws in the finished product.
The Georgia Institute of Technology, Atlanta, announces that its researchers used an electrochemical etching process to create a nanotextured surface that kills bacteria on a common stainless steel alloy.
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Thermo Scientific, Madison, Wis., introduces the Genesys family of automated, robust UV-Visible spectrophotometers, which are accessible, network-ready, and designed to meet expectations for advanced technology in a compact package.
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A team of researchers from three universities reports that amorphous silicon can be grown into superelastic horseshoe-shaped crystalline nanowires that can undergo stretching of more than twice their original length, and still maintain their excellent electric properties.
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NanoAl LLC, Skokie, Ill., has been awarded a Phase II SBIR grant of more than $1 million from the U.S. Department of Energy to develop a low cost, improved conductor alloy for overhead power wires.
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Hirox-USA, Hackensack, N.J., introduces the RH-2000 3D digital microscope, which features high-performance lenses with incorporated zoom technologies, built-in illumination, and precision mechanisms.
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The National Academy of Inventors, Washington, D.C., announces that Prof. Zhigang Zak Fang has been elected to the rank of NAI Fellow.
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Picosun Oy, Finland, reports that it has developed atomic layer deposition technology in which nanolaminates specifically tailored to form dense, conformal, and hermetic seals are deposited on printed circuit board assemblies (PCBA).
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Rice University, Houston, announces that its researchers have determined that fibers made of carbon nanotubes configured as wireless antennas can be as good as copper antennas but 20 times lighter.
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Hamamatsu Photonics KK, Japan, announces an agreement to acquire Energetiq Technology Inc., Woburn, Mass., for its laser-driven light sources and extreme-ultraviolet light sources.
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NanoAl Superalloys, Skokie, Ill., announces that its engineers will present six papers about its high-strength aluminum alloys at MS&T 2017 in Pittsburgh in October, some in conjunction with engineers from universities and other companies.
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WITec, Germany, announces that its solution for correlative Raman-SEM imaging is now available for Zeiss Sigma 300, a field emission scanning electron microscope (FE-SEM).
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Semiconductor Research Corporation (SRC), Durham, N.C., is establishing a new $300 million initiative to create a smart, autonomous, safe, connected, efficient, and affordable future through focused, long-term research that goes beyond traditional scaling.
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Following a substantial increase in semiconductor capital expenditures during the first half of this year, IC Insights Inc., Scottsdale, Ariz., raised its annual semiconductor capex forecast to a record high of $80.9 billion for 2017, a 20% increase from $67.3 billion in 2016.
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Bruker, Madison, Wis., and Dectris, Switzerland, announce that they have collaborated to integrate the Dectris Eiger2 R 500K hybrid photon counting pixel detector with the Bruker D8 Advance and the D8 Discover instrument platform to further improve performance for numerous X-ray diffraction applications.
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