Chalmers University of Technology, Sweden, announces that its researchers have shown that carbon nanomaterials such as graphene can replace expensive metals such as tin, silver, tungsten, beryllium, and indium in electronic devices.

Northwestern University, Evanston, Ill., announces that its Materials Research Science and Engineering Center has received a six-year, $15.6 million grant from the National Science Foundation.

Oxford Instruments, Concord, Mass., introduces a real-time navigation and imaging system for the SEM that helps users interactively explore samples based on video-rate X-ray maps colored by element rather than the black and white electron image alone.

Hitachi High-Technologies Corp., Tokyo, announces the development of an all-new high-performance Ethos FIB-SEM based on a newly developed magnetic/electrostatic compound lens that enables it to deliver advanced imaging performance resolving sub-nanometer features in high contrast for low-voltage SEM applications.

Stanford University, California, and the Massachusetts Institute of Technology, Cambridge, announce that researchers have developed a new semiconductor chip made of carbon nanotubes and resistive random-access memory (RRAM) cells.

Brewer Science Inc., Rolla, Mo., announces the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copolymers.

Hamburg University, Germany, announces that a group led by Dr. Christian Klinke has succeeded in producing transistors based on metal nanoparticles so small that they no longer show their metallic character under current flow, but they do exhibit an energy gap caused by the Coulomb repulsion of electrons.

Bruker Semiconductor Division, Billerica, Mass., announces that leading multiple semiconductor manufacturers have ordered JVSensus-600E X-ray diffraction imaging systems for in-line wafer monitoring of crystalline defects.

Bruker Corp., Germany, launches its S8 Tiger Series 2, the next-generation wavelength dispersive X-ray fluorescence spectrometer, said to be the most versatile WDXRF tool available for advanced quantitative elemental analysis.

JEOL USA, Peabody, Mass., introduces its new compact InfiTOF mass spectrometer, which is designed for real-time, direct gas introduction and analysis.

Hitachi High-Technologies Corp., Japan, introduces the new Regulus series of field emission scanning electron microscopes that offer enhanced functionality with improved resolution and operability.

Imec, Belgium, and Cascade Microtech, Germany, announce the successful development of a fully automatic system for pre-bond testing of advanced 3D chips.

IBM, Armonk, N.Y., announces the development of the first industry process for building silicon nanosheet transistors that will enable 5nm chips.

WIN Semiconductors Corp., Taiwan, has completed Phase 2 expansion at its newest wafer fab, Fab C, increasing manufacturing capacity by 20%.

Rogers Corp., Chandler, Ariz., will highlight its wide range of circuit materials at the 2017 IEEE International Microwave Symposium in June.

Oxford Instruments Nanoanalysis, England, has launched Symmetry, which is said to have acquisition speed in excess of 3000 indexed patterns per second.

Kyocera International Inc., San Diego, announces that it has received Class Y certification for its semiconductor assembly operations.

The University of Michigan, Ann Arbor, reports that its chemists have invented a method to simultaneously synthesize and deposit germanium crystalline semiconductor films from water at room temperature using equipment that can be assembled for just a few dollars.