Argonne National Laboratory, Lemont, Ill., announces that a research team has developed a self-lubricating diamondlike carbon tribofilm that regenerates itself by breaking down the molecules of lubricating oil and rebuilding the tribofilm as it is worn away.

Bruker, Billerica, Mass., introduces the SkyScan 1275, a high-speed X-ray microtomography benchtop system specially designed for fast scanning using new advances in the technology of X-ray sources and efficient flat-panel detectors.

JEOL, Peabody, Mass., announces that a new FilterSpray module developed for the AccuTOF-DART mass spectrometer makes it possible to spot a sample on a disposable paper triangle for analysis by ambient ionization.

Jeol, Peabody, Mass., announces that a new FilterSpray module developed for the AccuTOF-Dart Mass Spectrometer makes it possible to spot a sample on a disposable paper triangle for analysis by ambient ionization.

Hitachi High-Technologies Corp., Tokyo, introduces the HT7800 Series Transmission Electron Microscope, which features digital operation under normal room light conditions (like the HT7700 model) and also incorporates improved electro-optics with many new functions.

Cadence Design Systems Inc., San Jose, Calif., announces its collaboration with the Taiwan Semiconductor Manufacturing Co. (TSMC) to further advanced-node design innovation with TSMC’s new 12nm FinFET Compact (12FFC) process technology.

A team of researchers at the University of Barcelona has reportedly demonstrated a new bonding technique for surface mounted devices in which an inkjet printer with ink that incorporates silver nanoparticles bonds the devices.

Sandia National Laboratories, Albuquerque, N.M., reports that its scientists have developed an aerosol deposition process in which ceramic nanoparticles form coatings when deposited at high speed at room temperature.

A team of scientists from the Nanoelectronic Materials Laboratory (NaMLab) and the Cluster of Excellence Center for Advancing Electronics Dresden at the Dresden University of Technology in Germany report that they have demonstrated the first germanium-based transistor that can be programmed between electron-(n) and hole-(p) conduction.

Worldwide semiconductor capital spending is projected to increase by 2.9% in 2017, to $69.9 billion, according to Gartner Inc.

Intel Corp., Santa Clara, Calif., announces plans to invest more than $7 billion to complete Fab 42, which is expected to be the most advanced semiconductor factory in the world.

Intel Corp., Santa Clara, Calif., plans to invest more than $7 billion to complete Fab 42, which is expected to be the most advanced semiconductor factory in the world.

Oxford Instruments Asylum Research, Goleta, Calif., announces the new Cypher VRS Video-Rate AFM, said to be the first and only full-featured video-rate atomic force microscope.

MTI Instruments, Albany, N.Y., introduces the MTII/Fullam SEMtester compact mechanical test system, which is specifically designed to fit inside scanning electron microscopes.

Researchers at the Massachusetts Institute of Technology’s Lincoln Laboratory, Cambridge, report that they have developed a microscope in which optical microscopy is combined with laser spectroscopy to enable identification of individual micron-sized particles.

Research managed by SUNY Polytechnic Institute, Utica, and conducted by a number of collaborating institutions, has led to findings that have been named a top ten 2016 breakthrough in physics by Physics World.

Imec, Belgium, has shown for the first time that a silicon-passivated germanium nMOS gate stack with reduced interface defect density reaches the same defect level as a silicon gate stack, and has high mobility with reduced positive bias temperature instability.