University of Twente, Netherlands, reports that scientists from its MESA+ research institute have developed a method for studying individual defects in transistors.
Continue readingNew method allows study of individual defects in transistors
Bruker introduces nano-scratch capability for nanomechanical testing
Bruker’s Nano Surfaces Division, San Jose, Calif., announces a nanoscale scratch option for its NanoForce Nanomechanical Testing System.
Continue readingBruker introduces nano-scratch capability for nanomechanical testing
Bruker’s Nano Surfaces Division, San Jose, Calif., announces a nanoscale scratch option for its NanoForce Nanomechanical Testing System, as well as an optional 200 mm vacuum chuck for the mounting of wafer samples,
Continue readingSiemens to acquire Mentor Graphics for its electronics IC and systems design
Siemens AG, Munich, and Mentor Graphics, Wilsonville, Ore., announce that they have entered into a merger agreement under which Siemens will acquire Mentor for its electronics IC and systems design, simulation, and manufacturing solutions.
Continue readingBruker introduces nano-scratch capability for nanomechanical testing
Bruker’s Nano Surfaces Division, San Jose, Calif., announces a nanoscale scratch option for its NanoForce Nanomechanical Testing System.
Continue readingMetamaterials enable the first optically controlled electronic devices
Engineers from the Applied Electromagnetics Group at the University of California San Diego report that they have fabricated the first semiconductor-free, optically controlled microelectronic device.
Continue readingSamsung expands its advanced foundry products portfolio with 14LPU/10LPU processes
Samsung Electronics Co. Ltd., Japan, announced at its Device Solutions America headquarters in San Jose, Calif., that it is expanding its advanced foundry process technology products with the fourth-generation 14-nm process and the third-generation 10-nm process.
Continue readingZeiss and ASML strengthen partnership for EUV semiconductor lithography
ASML Holding NV, Netherlands, and Carl Zeiss SMT, Germany, have agreed to strengthen their partnership in the semiconductor lithography business to facilitate the development of the next generation of extreme ultraviolet (EUV) lithography systems.
Continue readingNanocomposite coating imparts anti-icing properties to substrate
NEI Corp., Somerset, N.J., reports that it has enhanced the performance of its anti-ice coating, Nanomyte SuperAi, a nanocomposite coating that imparts anti-ice properties to the underlying substrate.
Continue readingUniversity at Buffalo receives $2.9 million for modeling/simulations lab
The University at Buffalo, N.Y., has received a $2.9 million National Science Foundation grant to transform the traditional role of a database as a repository for information into an automated computer laboratory that rapidly collects, interprets, and learns from massive amounts of information.
Continue readingPulsed electron beams enable rapid deposition of Ga-La-S thin films
The University of Southampton, England, announces that a research group has developed a rapid deposition technology in which pulsed beams of electrons break up a gallium-lanthanum-sulfur (GLS) glass target material and deposit it as a thin film onto a substrate at a rate greater than 0.2 microns/minute.
Continue readingNXP Semiconductors to participate in SRC research initiatives
Semiconductor Research Corporation (SRC), Durham, N.C., announces that NXP Semiconductors, Netherlands, has signed an agreement to participate in multiple SRC research initiatives.
Continue readingShimadzu infrared microscope enables high-sensitivity analysis of electronic devices
Shimadzu Scientific Instruments (SSI), Japan, announces the release of the AIM-9000 infrared microscope with automated analysis functions and an enhanced wide field camera option.
Continue readingGlobal Foundries to invest over $2 billion to produce 7nm computer chips
Global Foundries, Santa Clara, Calif., says it will invest more than $2 billion at its Fab 8 facility in Malta, in upper New York state, to produce cutting-edge 7nm computer chips that will offer high performance for the next era of computing applications.
Continue readingNIST releases guide to fractography of ceramics and glasses
NIST, Gaithersburg, Md., has released a new, expanded edition of the NIST Recommended Practice Guide, “Fractography of Ceramics and Glasses” (NIST Special Publication 960-16e2), a guide developed to help engineers and scientists analyze the patterns in fractures of ceramics and glasses.
Continue readingSEMI and MSIG to join in strategic association partnership
Semi, San Jose, Calif., announces that MEMS & Sensors Industry Group (MSIG) will become a Strategic Association Partner effective January 1, 2017.
Continue readingSAS lab provides failure analysis and supports process development
Semiconductor Analytical Services Inc., Milpitas, Calif., has opened a new analytical laboratory to support process development and production of microelectronic devices and other high-technology products.
Continue readingGlobal GaN semiconductor devices market to be worth $3.4 billion by 2024
Transparency Market Research (TMR), Pune, India, reports that its analysis shows the global market for gallium nitride semiconductor devices will rise from $870.9 million in 2015, to $3.4 billion by 2024.
Continue readingHelios G4 CX plasma focused ion beam instrument enables nanometer analysis
FEI Co., Hillsboro, Oregon, announces that the latest technological innovations of the Helios G4 CX plasma-focused ion beam instrument, in combination with comprehensive software and FEI’s application expertise, allow Helios G4 CX with optional AS&V4 software to acquire the highest-quality multi-modal 3D datasets.
Continue readingCould sand keep your cell phone cool?
Sandy silicon dioxide nanoparticles coated with a high dielectric constant polymer could inexpensively provide improved cooling for increasingly power-hungry electronic devices.
Continue readingAmkor receives “Device of the Year” for SWIFT semiconductor package
Amkor Technology Inc., Tempe, Ariz., recently received the 3D InCites “Device of the Year” award during SEMICON West for its SWIFT semiconductor package.
Continue readingRudolph Clearfind Technology detects organic defects
Rudolph Technologies Inc., Wilmington, Mass., introduces its Clearfind technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging techniques.
Continue readingCoventor wins “Best of West” Award
Coventor, Cary, N.C., announces that it has won the “Best of West” award presented by Solid State Technology and SEMI a the Semicon West conference July 13.
Continue readingNondestructive hybrid system integrates XRF and 3D optical methods
XwinSys, Carefree, Ariz., recently launched the Onyx, a novel in-line and nondestructive hybrid metrology system that uniquely integrates advanced XRF with 2D and 3D optical technologies.
Continue readingHelios PFIB enables advanced failure analysis of semiconductors
FEI Co., Hillsboro, Ore., offers the Helios PFIB, said to be the world’s most advanced DualBeam Plasma FIB platform for large area deprocessing to enable electrical fault isolation of advanced process ICs and advanced failure analysis of 3D packages.
Continue readingCadence announces Intel- certified implementation and signoff tools
Cadence Design Systems Inc., San Jose, Calif., announces that its implementation and signoff tools have achieved certification on the Intel third-generation 10 nm tri-gate process for customers of Intel Custom Foundry.
Continue readingHitachi Conductor etch system supports double patterns and 3D structures
Hitachi High-Tech, Schaumburg, Ill., has developed the 9000 Conductor Etch Series to support next-generation devices at 20 nm and below that require double-patterning, 3D structures, and complex, high-precision processes.
Continue readingMentor Graphics to provide access to AMS design flow for ARM Cortex-M0
Mentor Graphics Corp., Wilsonville, Ore., has announced a collaboration with ARM to provide accessible and affordable access to Mentor’s Tanner AMS analog/mixed-signal design flow for ARM Cortex-M0 processor-based implementations as part of the ARM DesignStart program.
Continue readingShape-memory polymers exhibit triple shape-memory behavior
Oak Ridge National Laboratory, Tenn., reports that a team of researchers from ORNL, Washington State University, and the University of Idaho, have developed shape-memory polymers that exhibit triple-shape-memory behavior, meaning that the polymers can transform from one temporary shape to another at one temperature, and then back to a permanent shape at a different temperature.
Continue readingElectric field can instantly switch shape-memory graphene oxide film
Monash University, Australia, announces that its engineering team has developed graphene oxide material that is one nanometer thick whose shape can be changed almost instantaneously by an electric field.
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