With the advent of nanotechnology, not only can tiny particles be deposited, but the target surfaces or substrates can also be tailored to control the resulting structures.
Continue readingSEMI report: 19 new fabs and lines to start construction
SEMI, San Jose, Calif., announces that 19 new fabs and lines are forecast to begin construction in 2016 and 2017, according to the latest update of the SEMI World Fab Forecast report.
Continue readingFEI launches three tools for next-generation semiconductor failure analysis
FEI Co., Hillsboro, Ore., introduces three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing: the Helios G4 DualBeam EXL, The Metrios DX TEM, and the ExSolve 2 WTP.
Continue readingThermo Fisher Scientific acquires FEI Company for $4.2 billion
Thermo Fisher Scientific Inc., Waltham, Mass., announces that it is to acquire FEI Co., Hillsboro, Ore., for approximately $4.2 billion.
Continue readingMultifunctional heating and electrical system enables in-situ TEM and SEM analysis
Protochips, Morrisville, N.C., has released its Fusion multi-functional heating and electrical system for in-situ electron microscopy.
Continue readingGlowing nanosubmarines to deliver drugs and cargo
The next generation of nanosubmarines has been upgraded with tags that fluoresce longer allowing them to be tracked for greater periods while being driven through solutions.
Continue readingLong-life flexible printed electronics encapsulated with Picosun ALD
Picosun Oy, Finland, brings to the printed electronics market ALD equipment specifically designed for large-area flexible electronics encapsulation.
Continue readingNanolaminated MoAlB coating resists corrosion at high temperatures
Drexel University, Philadelphia, announces that a research team from Drexel, Linkoping University in Sweden, and Imperial College London, has produced a nanolaminated molybdenum-aluminum-boride coating that resists corrosion at high temperatures.
Continue readingRare-earth alternative could ensure future electronics
Technologies from wind turbines to electric vehicles rely on critical materials called rare-earth elements.
Continue readingAdvanced Heat Treat completes Phase I of plasma nitriding evaluation
Advanced Heat Treat Corp. (AHT), Waterloo, Iowa, announces that it has completed Phase I of a grant to evaluate plasma nitriding for improved life of forging dies by generating a hard case on tribological surfaces.
Continue readingIntel announces restructuring initiative to accelerate transformation
Intel Corp., Santa Clara, Calif., announces a restructuring initiative to accelerate its evolution from a PC company to one that powers the cloud and billions of smart, connected computing devices.
Continue readingFlextech announces completion of three flexible hybrid electronics projects
FlexTech, a Semi Strategic Association Partner, San Jose, Calif., announces the formal completion of three flexible hybrid electronics R&D projects under its U.S. Army Research Laboratory technology investment agreement.
Continue readingVariable-pressure SEM achieves 4-nm resolution
Hitachi High Technologies America Inc., Schaumburg, Ill., has released the FlexSEM 1000, a compact SEM system with a minimized, lab-friendly footprint, 6 to 100 Pa variable pressure, and 4 nm resolution, while offering superior ease of use for operators of all skill levels.
Continue readingAmorphous steel powder metallurgy alloy has highest impact resistance
The University of California San Diego announces that a team of engineers has developed and tested SAM2X5-630, a type of amorphous steel with a record-breaking ability to withstand impact without deforming permanently.
Continue readingJeol Neoscope SEM enables rapid inspection of electronics
Jeol USA, Peabody, Mass., introduces a new benchtop SEM, the JSM-6000Plus, the third generation of the NeoScope, which delivers fast, high-magnification electron microscopy with more functionality than typical benchtop SEMs.
Continue readingTaiwan is new global leader in total IC wafer fab capacity
IC Insights, Scottsdale, Ariz., recently released its new “Global Wafer Capacity 2016-2020” report showing that, as of December 2015, Taiwan is now the global leader in wafer capacity with nearly 22% of worldwide IC capacity installed in the country.
Continue readingMarket for GaN and SiC power semiconductors to top $1B in 2020
IHS Inc., Englewood, Colo., reports that the emerging market for silicon carbide and gallium nitride power semiconductors is forecast to pass the $1 billion mark in five years, energized by demand from hybrid and electric vehicles, power supplies, and photovoltaic inverters.
Continue readingAdvanced power amplifiers enable faster data access, better connections
Global Foundries, Santa Clara, Calif., announces advanced radio-frequency silicon solutions for power amplifiers, further expanding the portfolio of silicon-germanium power amplifier technologies designed to enable performance-optimized cellular and Wi-Fi devices.
Continue readingAmkor receives quality award from Intel
Amkor Technology Inc., Tempe, Ariz., has been recognized as one of 26 companies receiving Intel Corporation’s Preferred Quality Supplier award for its performance in 2015.
Continue readingToshiba to invest $3.2 billion in 3D flash-memory chip factory
Toshiba Corp., Japan, announces that it will invest $3.2 billion in a new factory for BiCS Flash, its proprietary 3D flash memory chips.
Continue readingAluminum with added carbon nanotubes shows longer life under radiation
The Massachusetts Institute of Technology, Cambridge, reports its researchers have found that, at least in some nuclear reactors, adding less than 2% carbon nanotubes to aluminum can dramatically slow the breakdown process that causes it to become porous and brittle.
Continue readingEuropean collaboration to build high-energy ball mill plant for nanopowders
The United Kingdom’s Centre for Process Innovation (CPI) and nine other European partners are collaborating in the design, scale-up, and build of a high energy ball-mill (HEBM) pilot plant for the production and validation of innovative nanostructured powders.
Continue readingUTC Aerospace Systems opens $8 million advanced materials laboratory in Connecticut
UTC Aerospace Systems, Windsor Locks, Conn., has opened an $8 million, 20,000 ft2 state-of-the-art Materials and Process Engineering laboratory to support research, engineering, and production of advanced materials for aerospace applications.
Continue readingVeeco TurboDisc As/P MOCVD reactor system enables 20% cost reduction
Veeco Instruments Inc., Plainview, N.Y., has launched the TurboDisc K475i arsenic phosphide (As/P) metal organic chemical vapor deposition (MOCVD) system for the production of red, orange, and yellow light-emitting diodes, as well as multi-junction III-V solar cells, laser diodes, and transistors.
Continue readingSoitec announces volume manufacturing of 300mm RF-SOI substrates
Soitec, France, has begun mass production of 300mm radio-frequency silicon-on-insulator (RF-SOI) substrates for mobile communications.
Continue readingSuny Polytechnic and Global Foundries establish $500 million EUV program
Suny Polytechnic Institute, Utica, N.Y., and Global Foundries, Milpitas, Calif., have established a new Advanced Patterning and Productivity Center, a $500 million, five-year program to accelerate the introduction of extreme ultraviolet lithography technologies into manufacturing.
Continue readingSuny Polytechnic and Global Foundries establish $500 million EUV program
Suny Polytechnic Institute, Utica, N.Y., and Global Foundries, Milpitas, Calif., have established a new Advanced Patterning and Productivity Center, a $500 million, five-year program to accelerate the introduction of extreme ultraviolet lithography technologies into manufacturing.
Continue readingWavelength scanning pixel super-resolution enhances digital microscopy images
Researchers from the California NanoSystems Institute at UCLA have reportedly developed a new technique that greatly enhances digital microscopy images.
Continue readingLibrary of nanoporous gold structures produced on single chip via tunable lasers
Lawrence Livermore National Laboratory. Livermore, Calif., reports that its researchers have created a library of nanoporous gold structures on a single chip that has direct applications for high-capacity lithium ion batteries as well as neural interfaces.
Continue readingSEMI Awards honor process and technology integration achievements
SEMI, San Jose, Calif., announces the recipients of the 2015 SEMI Awards for innovations that have become such an integral part of the semiconductor manufacturing industry’s infrastructure that the technology itself has become fundamental.
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