DCG Systems, Fremont, Calif., announces that three of its nProber II nanoprobing systems have been purchased by a major IC manufacturer who is developing technology beyond the 14nm node.
Continue readingDuplex stainless steel yacht is lighter than aluminum
Sandvik Materials Technology, Sweden, has built a prototype stainless steel yacht manufactured entirely of Sandvik SAF 2507 duplex stainless steel.
Continue readingOxford Asylum’s MFP-3D Infinity AFM reduces XY sensor noise by 70%, Z-sensor noise by 85%
Oxford Instruments Asylum Research, Goleta, Calif., announces the new MFP-3D Infinity Atomic Force Microscope (AFM).
Continue readingBruker introduces online XRF coating analyzer
Bruker Corp., Santa Barbara, Calif., presents an online coating analyzer, the S2 Kodiak, which is based on X-ray fluorescence spectrometry.
Continue readingGlobal Foundries and Samsung form joint program for 14nm FinFETs
Global Foundries, Austin, Texas, and Samsung, Japan, announce a joint program for fabless companies to skip the 20nm node and move straight to 14nm FinFETs.
Continue readingMaterion to partner with AristoCast for AlBeCast investment castings
Materion Brush Beryllium & Composites, a Materion Corporation business, Elmore, Ohio, announces that it has qualified and entered into a strategic manufacturing and marketing partnership with Aristo Cast Inc.
Continue readingSilver-filled adhesive film enables high-temperature operation
The Advanced Circuit Materials Division of Rogers Corp., Rogers, Conn., launches Coolspan thermally and electrically conductive adhesive (TECA) film.
Continue readingAltera and Intel to collaborate on multi-die devices
Altera Corp., San Jose, Calif., and Intel Corp., Santa Barbara, Calif., announce their collaboration on the development of multi-die devices that leverage Intel’s world-class package and assembly capabilities and Altera’s leading-edge programmable logic technology.
Continue readingErbium-antimony nanostructures manipulate light in the infrared range
Researchers at the University of California at Santa Barbara have developed an erbium-antimony semiconductor of nearly perfect quality that can manipulate light energy in the mid-infrared range.
Continue readingScalable CVD process enables one atom-thick layers of molybdenum diselenide semiconductor
Researchers at Rice University in Houston and Nanyang Technological University in Singapore have developed a potentially scalable CVD method for making one-atom-thick layers of molybdenum diselenide.
Continue readingBruker Introduces online XRF coating analyzer
Bruker Corp., Santa Barbara, Calif., presents an online coating analyzer, the S2 Kodiak, which is based on X-ray fluorescence spectrometry.
Continue readingUltralight plane solely powered by the sun
The Solar Impulse 2 aircraft will be the first to travel around the world entirely without fuel in 2015 and was recently unveiled in Payerne, Switzerland.
Continue readingHarnessing sun power even when it’s not shining
A team at Massachusetts Institute of Technology, and Harvard University, both in Cambridge, came up with a material that can absorb the sun’s heat and store that energy in chemical form, ready to be released again on demand.
Continue readingMaterials research partnership renewed
Mitsubishi Chemical Corp., Tokyo, and University of California, Santa Barbara, are extending their successful materials research alliance—the Mitsubishi Chemical Center for Advanced Materials (MC-CAM) at UCSB—for a new period.
Continue readingNovelis launches aluminum beverage can with 90% recycled content
Novelis, Atlanta, announces that Red Hare Brewing Company will launch the world’s first commercial use of Evercan, the company’s independently certified high-recycled-content aluminum sheet for beverage cans.
Continue readingVac Aero commissions vacuum furnace for aerospace manufacturer
Vac Aero, Burlington, Ontario, has commissioned a high-vacuum production-scale, 2-bar VAH3436 horizontal vacuum furnace with work zone dimensions of 24-in. wide x 24-in. high x 36-in. deep.
Continue readingLucifer Furnaces supplies high temperature box furnace to battery maker
Lucifer Furnaces, Warrington, Pa., recently shipped a high-temperature laboratory box furnace to a leading producer of products for the battery, ceramics, and glass industries around the globe.
Continue readingFirst issue of ASM/TMS Energy Journal
The first issue of Metallurgical and Materials Transactions E: Materials for Energy Systems, a new journal of peer-reviewed, original research and review articles focused on the science and technology of energy materials.
Continue readingNew Auto Consortium targets material challenges
At the SAE World Congress in Detroit, Granta Design, UK, announced the launch of the Automotive Material Intelligence Consortium (AutoMatIC).
Continue readingConstellium to build two casthouses to triple production of Airware aluminum
Constellium, Paris, plans to build two new casthouses for its Airware aerospace aluminum products at its plant in Issoire, France.
Continue readingSuspension plasma spray with ceramic nanoparticles may triple service life of aircraft engines
Researchers at University West in Sweden have developed a technology in which ceramic nanoparticles are suspended in a liquid and then plasma-sprayed.
Continue readingJames Webb space telescope relies on beryllium mirrors
NASA Goddard Space Flight Center, Greenbelt, Md., is building the James Webb space telescope, whose unique beryllium mirror system will enable it to examine the earliest times of the universe when launched in 2018.
Continue readingLockheed Martin opens materials and thermal sciences R&D lab in Palo Alto
The Lockheed Martin Space Systems Advanced Technology Center, Palo Alto, has opened an Advanced Materials & Thermal Sciences Center for research and development.
Continue readingTimken forms joint venture to manufacture rail bearings in Russia
The Timken Co., Canton, Ohio, has entered into an agreement with United Wagon Company (UWC) to establish a joint venture to manufacture Timken AP-2 rail bearings in Russia.
Continue readingSUSS MicroTec launches projection scanner for advanced packaging
SUSS MicroTec, Germany, has launched the DSC300 Gen2 projection scanner, a platform for wafer sizes up to 300 mm based on the projection lithography technology developed by SUSS MicroTec Photonic Systems Inc. (formerly Tamarack Scientific).
Continue readingDirected self-assembly developed to advance semiconductor manufacturing
Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that researchers it sponsors at the Massachusetts Institute of Technology have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.
Continue readingOxide nanosheets enable capacitance with 2000 times higher stability
Researchers at the Japan National Institute for Materials Science, International Center for Materials Nanoarchitectonics, and Shinshu University in Japan report that they have developed high-performance ultrathin capacitors.
Continue readingGraphene-coated copper wire dissipates heat 25% faster
Researchers at the University of California Riverside, and the University of Manchester, U.K., report that that a sandwich made of graphene on both sides of a sheet of copper improves the copper’s ability to dissipate heat by 25%.
Continue readingApplied Materials and Tokyo Electron to merge
Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., report that they have received notice from the Committee on Foreign Investment in the United States (CFIUS) that there are no unresolved national security issues relating to the proposed business combination announced last year.
Continue readingRhenium disulfide semiconductor bulk material acts like a 2D monolayer
Researchers at the Berkeley Lab Molecular Foundry report that they have developed rhenium disulfide, a semiconductor that functions electronically as if it were a 2D monolayer even as a 3D bulk material.
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