Industries and Applications Archives - Page 90 of 114

Gecko-like gripper aids semiconductor manufacturing

Picking things up and putting them down is a mainstay of any kind of manufacturing, but fingers, human or robotic, are not always best for the task at hand.

Testing unmanned aircraft systems

NASA, working with government and industry partners, is testing a system that would make it possible for unmanned aircraft to fly routine operations in U.S. airspace.

SecoWarwick to deliver equipment for recycling aerospace titanium in Europe

Seco-Warwick Europe, Poland, together with Retech Systems, Ukiah, Calif., have signed a contract for delivery of a comprehensive melt-shop equipment package to a new European facility for recycling aviation-grade titanium.

Dual chamber furnace enables simultaneous hardening and tempering

Lucifer Furnaces, Warrington, Pa., announces that a Red Devil dual chamber furnace has been added to the line of analytical equipment at Laboratory Testing Inc., Philadelphia.

ThyssenKrupp and Maxion to jointly develop aluminum/carbon-fiber wheels

ThyssenKrupp Carbon Components, Germany, and Maxion Wheels, Novi, Mich., announce a cooperative agreement to develop and market ultra-lightweight aluminum and carbon fiber hybrid wheels for the premium vehicle OEM market.

The Bright World of Metals: Four trade fairs in Düsseldorf

“The Bright World of Metals” trade fair quartet in Düsseldorf, Germany, closed to extremely positive results, with 78,000 visitors from more than 120 countries.

SEMI reports fabs are expected to grow spending

SEMI, San Jose, Calif., has published its May update to the World Fab Forecast, reporting on more than 200 facilities with equipment spending in 2015, and more than 175 facilities projected to spend in 2016.

New process enables quick separation of neodymium and dysprosium

Researchers at the University of Pennsylvania, Philadelphia, have reportedly developed a process that could enable the efficient recycling of two rare earth metals, neodymium and dysprosium.

Calibre PERC platform chosen for reliability verification by Intel Custom Foundry

Mentor Graphics Corp., Wilsonville, Ore., announces that Intel Custom Foundry is expanding its 14nm platform offering to include reliability verification based on the Calibre PERC platform for its customers.

New hybrid techniques for backside thinning and polishing improve device uniformity

Ultra Tec Manufacturing, Santa Ana, Calif., has developed new hybrid 3D backside thinning and polishing techniques for the achievement of extremely uniform remaining silicon thickness.

Bruker microscope integrates imaging with 3D optical metrology

Bruker Corp., Billerica, Mass., has released its new Contour Elite 3D Optical Microscopes, which for the first time fully integrate high-definition microscopy imaging with industry-leading three-dimensional optical metrology functionality.

DualBeam PFIB enables failure analysis on semiconductors smaller than 20 nm

FEI, Hillsboro, Ore., introduces the DualBeam plasma-focused ion beam (PFIB) for sample preparation, electrical fault isolation, and electrical failure analysis on sub-20nm semiconductor devices.

DCG Systems acquires MultiProbe for its atomic force probe technology

DCG Systems, Fremont, Calif., has acquired the assets of MultiProbe, the leading provider of atomic force-based nanoprobe solutions for the semiconductor industry.

Graphene coated copper wire could boost chip speeds by up to 30%

Researchers from Stanford University, Stanford, Calif., report that they have developed graphene sheathing material for the copper wires in computer chips.

Transparent stretchable conductors based on nano-accordion structure

Researchers from North Carolina State University, Raleigh, report that they have fabricated stretchable transparent conductors that work because of their “nano-accordion” design.

Flexible polymer electrodes printed with improved electrical properties

The Technical University of Munich (TUM) announces that its researchers have printed razor-thin polymer electrodes with improved electrical properties.

New quantum effect could lead to novel nanoelectronics

A quantum mechanical transport phenomenon demonstrated for the first time in synthetic, atomically-thin layered material at room temperature could lead to novel nanoelectronic circuits and devices, according to researchers at Pennsylvania State University, College Park.

Novel material significantly improves traditional aerogel properties

A new polyimide aerogel developed at NASA’s Glenn Research Center, Cleveland, represents a revolutionary advance over the fragile silica aerogels currently on the market.

ATI achieves PQ titanium product and process qualification

Allegheny Technologies Inc., Pittsburgh, has achieved qualification for its premium-titanium products for jet engine rotating parts made of premium-quality titanium sponge from ATI’s facility in Rowley, Utah.

Carpenter agrees to supply powder metallurgy superalloys to Pratt & Whitney

Carpenter Technology Corp., Wyomissing, Pa., reports that operations will begin soon at its new superalloy powder facility in Alabama as part of a multi-level agreement with United Technologies Corporation’s Pratt & Whitney Division.

AFC-Holcroft supplies two universal batch quench furnaces to Paulo Products

AFC-Holcroft, Wixom, Mich., has supplied two new Universal Batch Quench furnaces to Paulo Products Co., a commercial heat treater headquartered in St. Louis, to be installed at its Kansas City Division.

Carpenter agrees to supply powder metallurgy superalloys to Pratt & Whitney

Kanthal heating elements for service at 3050°F have fast temperature ramping

Sandvik Materials Technology, Sweden, announces that its Kanthal division introduced Superthal FeCrAlMo heating elements at the Thermprocess show held last week in Dusseldorf.

Collaboration to develop carbon fiber for automotive light-weighting

The Ford Motor Co., Dearborn, Mich., and DowAksa, Turkey signed a joint development agreement to formally advance research on cost-effective, high-volume manufacturing of automotive-grade carbon fiber.

New computer chips made with futuristic materials

Researchers developed a technique for integrating “III-V” materials onto silicon wafers, a breakthrough that may allow an extension to Moore’s Law

Ripples of a particle-separating wave seen in primordial plasma

Scientists in the STAR collaboration at the Relativistic Heavy Ion Collider (RHIC) have new evidence for what’s called a “chiral magnetic wave” rippling through the soup of quark-gluon plasma created in RHIC’s energetic particle smashups.

Rocketdyne selects Seco-Warwick box furnace for heat treating and brazing rocket parts

Seco-Warwick, Meadville, Pa., reports that Aerojet Rocketdyne has updated its facility in West Palm Beach, Fla., with the turnkey installation of a Seco-Warwick custom-engineered box furnace for brazing and heat-treating rocket parts and assemblies.

Bodycote opens new heat treatment plant in Poland

Bodycote, South Windsor, Conn., recently opened a new heat treatment site in Wroclaw, Poland, as part of its expansion strategy in Eastern Europe.

Worthington’s TWB Company to open tailor welded blank facility in Nashville

Worthington Industries, Cleveland, announces that its tailor welded blanking joint venture, TWB Company LLC, is opening a new facility in Nashville, Tenn.