The 2015 International Thermal Spray Conference joined AeroMat and IMS for the first-ever combined mega-event in Long Beach, Calif.
Continue readingReport on ITSC 2015 in Long Beach
Arcam invests in third plasma atomization reactor for titanium powder
Arcam AB, Sweden, announces that a third plasma titanium atomization reactor at its powder manufacturing subsidiary AP&C in Montreal is now operational.
Continue readingLPW Technology and Metalysis partner to advance spherical tantalum and tungsten powders
LPW Technology Inc., Pittsburgh, and Metalysis, U.K., have formed a collaboration with the goal of developing an alternative supply chain for clean, spherical tantalum and tungsten powders for critical applications.
Continue readingSTRESS RELIEF — 3D-print your laptop
Using PLA filament, a small London-based team have managed to achieve the 3D printing of their own Raspberry-Pi-based laptop, with a battery life of six to eight hours and Wi-Fi enabled out of the box.
Continue reading3D printed biogel
Stretchable, biocompatible hydrogels with complex patterning could be used in tissue engineering.
Continue readingLeading innovation institutes convene in Detroit
LIFT, America Makes, and DMDII will inspire a new generation of investment in manufacturing technologies.
Continue readingOutokumpu now categorizes its stainless steels by properties instead of chemistry
Outokumpu Oy, Finland, has developed a way to categorize its wide range of stainless steel products by arranging them according to strength, hardness, machinability, heat resistance, and corrosion resistance.
Continue readingNASA awards Boeing first commercial human spaceflight mission
NASA, Houston, has issued a task order as part of Boeing’s $4.2 billion Commercial Crew Transportation Capability contract to include the company’s first-ever service flight to the International Space Station.
Continue readingThyssenKrupp supplies elevators and stainless steel to One World Trade Center
ThyssenKrupp, Germany, has installed stainless steel for the spire of the tower, and the fastest elevators in North and South America at One World Trade Center in New York.
Continue readingTA Instruments acquires assets of Bose ElectroForce Group
TA Instruments, New Castle, Del., announces that it has acquired certain assets related to the Bose ElectroForce Group, Framingham, Mass.
Continue readingConferences convene for successful Mega Show event
Aerospace and thermal spray professionals gathered for aerospace coating and materials information.
Continue readingHow microbes acquire electricity in making methane
Scientists at Stanford University, Calif., solved a long-standing mystery about methanogens—unique microorganisms that transform electricity and carbon dioxide into methane.
Continue reading3D-Printed Habitat Challenge
NASA and the National Additive Manufacturing Innovation Institute, known as America Makes, are holding a new $2.25 million competition to design and build a 3D printed habitat for deep space exploration.
Continue readingWinners of Materials Genome Toolkit competition announced
ASM International’s CMD Network is pleased to announce the winners of the 2015 ASM Materials Genome Toolkit competition.
Continue readingEFD Induction rotary table system hardens sun gears for auto supplier
EFD Induction USA, Madison Heights, Mich., reports that a major U.S. tier-one automotive supplier recently ordered an EFD Induction Rotary Table (HardLine RT 550) hardening system for treating sun gears, and a vertical scanner system (HardLine VM 1000) for hardening output shafts.
Continue readingOutokumpu stainless steel fuel tank weighs 3 kg less than plastic
Outokumpu Oy, Finland, announces that the stainless steel fuel tank developed by its engineers and TechROi Fuel Systems received the New Applications Award presented by the International Stainless Steel Forum in the “Best New Development” category at the ISSF Annual Conference in Hong Kong.
Continue readingOlympus portable digital ultrasonic flaw detector has full-screen A-scan mode
Olympus Scientific Solutions Americas Inc., Waltham, Mass., introduces the Epoch 650 digital ultrasonic flaw detector that combines conventional ultrasonic flaw detection capabilities with the efficiency of a highly portable, intuitive instrument.
Continue readingHelios NanoLab combines high-resolution SEM and FIB with precision deposition
FEI Co., Hillsboro, Ore., offers the Helios NanoLab 460F1, which combines the highest resolution scanning electron microscope (Elstar+UC SEM) and focused ion beam (Tomahawk FIB) columns on the market today with the most advanced sample manipulation capabilities.
Continue readingJeol e-beam lithography system to write high-resolution circuitry patterns for nanofab
Jeol USA, Peabody, Mass., announces that a state-of-the-art Jeol e-beam lithography system will soon be installed at the University of Waterloo Quantum NanoFab in Waterloo, Ontario.
Continue readingHigh-vacuum SSRM AFM system designed for semiconductor failure analysis
Park Systems, Santa Clara, Calif., introduces the NX-Hivac AFM system for semiconductor failure analysis.
Continue readingSilver sinter paste for power semiconductors has strong adhesion to copper
Kyocera America Inc., San Diego, announces the U.S. introduction of its XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver higher performance than high-lead solders.
Continue readingTitanium nitride hardmask system enables patterning copper interconnects at 10 nm
Applied Materials Inc., Santa Clara, Calif., introduces the Applied Endura Cirrus HTX PVD titanium nitride hardmask system with advanced technology for patterning copper interconnects at 10 nm and beyond.
Continue readingElectroless deposition of cobalt enables void-free filling of vias for electronic chips
Imec, Belgium, and Lam Research Corp., Fremont, Calif., have reportedly developed a novel bottom-up cobalt prefill technique for vias and contacts for electronic chips.
Continue readingLaser-induced thermal cracking speeds production of silicon chips
The Agency for Science, Technology, and Research (A-Star), Singapore, reports that a laser-induced thermal cracking technology for cutting silicon wafers could streamline the production of smaller and more powerful microchips for electronic devices.
Continue readingMagnesium printed circuits designed to self-destruct on command
Researchers at the University of Illinois, Champaign, have reportedly developed heat-triggered self-destructing electronic devices.
Continue readingHarvesting energy from heartbeats
Researchers created thin, flexible electronic devices that efficiently harvest the mechanical energy from natural motions of the human body.
Continue readingProgram focuses on future materials scientists
With advances in science and technology, today’s high school students could end up working with materials that don’t even exist today.
Continue readingTiny grains of lithium improve fusion plasma performance
Scientists from General Atomics and the U.S. DOE’s Princeton Plasma Physics Laboratory (PPPL) discovered a phenomenon that helps improve fusion plasmas, which could ultimately speed fusion energy development.
Continue readingTinkertoy materials hold promise as temperature regulators
Sandia National Laboratories, Livermore, Calif., researchers made the first measurements of thermoelectric behavior by a nanoporous metal-organic framework (MOF).
Continue readingNew method for friction stir welding aluminum is ten times faster
Researchers at Pacific Northwest National Laboratory, Richland, Wash., in partnership with General Motors, Alcoa, and the Tailor Welded Blank (TWB) Co., have developed a friction stir welding technique that is said to be ten times faster than current FSW techniques.
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