Industries and Applications Archives - Page 7 of 11

inTEST Corporation launches innovative hover sense non-contact probe testing technology for electric vehicle battery testing

inTEST Corporation, Mt. Laurel, N. J., launched the Acculogic patent-pending hover sense non-contact technology for electric vehicle battery testing, representing a significant leap forward in validating the quality and reliability of EV battery interconnects.

TESCAN GROUP enhances presence in Korean electron microscopy and computed tomography market through merger & acquisition

TESCAN GROUP, a.s., Czech Republic, completed its acquisition of TESCAN KOREA, Ltd. and Daeil Microanalysis Laboratory, after two decades of successful collaboration consolidating efforts to better serve the Korean customers and market, particularly in the semiconductor domain.

ElevATE Semiconductor and GlobalFoundries partner on high-voltage chips for commercial and national security applications

ElevATE Semiconductor, San Diego, Calif., and GlobalFoundries (GF) announced a manufacturing partnership for high-voltage chips produced at GF’s facility in Essex Junction, Vermont.

Chaco metamaterial paves the way for exciting applications in memory storage

Scientists at Los Alamos National Laboratory, N. M., and Tel Aviv University, Israel, have achieved a breakthrough in material science with the creation of “Chaco,” a revolutionary metamaterial named after the historical site Chaco Canyon in New Mexico.

POSTECH researchers maximize the efficiency of hafnia-based ferroelectric memory devices

Researchers at Pohang University of Science and Technology, South Korea, have significantly enhanced the data storage capacity of ferroelectric memory devices using hafnia-based ferroelectric materials and an innovative device structure.

Greener electronics being developed to reduce unsustainably high levels of e-waste

To reduce unsustainably high levels of e-waste, an expert in green chemistry at Swedish research institute Research Institutes of Sweden has switched his focus from pulp to wood in a bid to make consumer electronic devices that have no carbon footprint and are easier to recycle.

Triton Systems to add Titomic TKF cold spray additive manufacturing capability

Titomic Limited, based in Brisbane, Australia, has announced the sale of a custom Titomic Kinetic Fusion System Cold Spray Additive Manufacturing machine to Triton Systems Inc., headquartered in Chelmsford, Mass..

Samsung develops industry’s fastest 10.7Gbps LPDDR5X DRAM, optimized for AI applications

Samsung Electronics, South Korea, a world leader in advanced memory technology, developed the industry’s first LPDDR5X DRAM supporting the industry’s highest performance of up to 10.7 gigabits-per-second.

TOPCon modules endure ‘significant degradation’ in damp heat testing compared to PERC

Scientists from the University of New South Wales published a report into passivated emitter and rear contact (PERC) and tunnel oxide passivated contact (TOPCon) solar modules, finding that the latter has endured “significant degradation” in damp heat testing.

NSF acquires PSILab, Inc., an advanced plastic pipe and materials testing laboratory

NSF, the leading global public health and safety organization in Ann Arbor, Mich., acquired PSILab, Inc., a US-based advanced product testing and consulting laboratory specializing in plastic pipe, pipe materials and other polymeric and composite products.

28th Maintenance Group’s Additive Manufacturing Flight accelerates mission readiness with mobile cold spray system

The Additive Manufacturing Flight of the U.S. Air Force’s 28th Maintenance Group became the first field-level unit to utilize the new Mobile Cold Spray System at Ellsworth Air Base, South Dakota.

DC power converter that provides significant boost and efficiency

Researchers at Kobe University, Japan, in partnership with National Chung Hsing University, Taiwan, developed a new electrical power converter design that provides considerably better efficiency at reduced cost and maintenance than before.

ORNL researchers enhance reliability of electric vehicle charging

Researchers at the Department of Energy’s Oak Ridge National Laboratory, Oak Ridge, Tenn., are developing algorithms and multilayered communication and control systems that make electric vehicle chargers operate more reliably, even if there is a voltage drop or disturbance in the electric grid.

Henkel semiconductor capillary underfill enables complex AI and HPC large body advanced packaging designs

Henkel, Germany, released a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.

Synopsys to acquire Ansys, creating a leader in silicon to systems design solutions

Synopsys, Sunnyvale, Calif., and Ansys, Canonsburg¸Pa., announced that they have entered into a definitive agreement under which Synopsys will acquire Ansys.

Suicide chips could boost electronics security

Researchers at the University of Vermont developed microchips with a feature that combines anti-counterfeit with a function that causes them to self-destruct if an attempt is made to compromise them.

Harper Furnace Technology enables high performance silicon anodes

Harper Furnace Technology, Buffalo, NY, announced the development of high temperature thermal process solutions to enable production at several silicon anode battery material companies in 2024. Silicon anode material offers significantly higher specific capacity than traditional graphite anode materials enabling higher power density, faster charge times and smaller carbon footprint than current batteries.

Harper has entered engineering design and equipment supply contracts for pilot and production scale equipment with its USA-based customers, many of whom are funded in part by grants from the U.S. Department of Energy. The Harper technology includes indirect electrically heated, continuous rotary, vertical and horizontal conveyor furnace systems for each customer’s unique thermochemical processes. The Harper furnaces include tight control of the process atmosphere enabling safe and reliable continuous operation, are rated for temperatures between 800˚C and 1,800˚C and will have capacity up to 1,000 metric tons per year. Beyond the pilot-scale equipment projects, Harper is actively engineering the next generation of equipment solutions for these customers whose commercial scale plants will require capacity of 20,000 – 40,000 metric tons per year for the electric vehicle (EV) market.

https://www.harperintl.com/app/uploads/2024/02/Silicon-Anodes-Press-Release-February-2024.pdf

IGS announces strategic Caribbean partnership with Monar Industrial Services

Integrated Global Services, Richmond, VA., a global leader in efficiency and reliability solutions, announced its official partnership with Monar Industrial Services, Caribbean.

Invisible armor for steel: how hBN coating is reinventing metal durability

Researchers at Oak Ridge National Laboratory, Oak Ridge, Tenn., demonstrated that stainless steel and other metal alloys coated with hexagonal boron nitride, or hBN, exhibit non-stick or low-friction qualities along with improved long-term protection against harsh corrosion and high-temperature oxidation in air.

Hitachi High-Tech launches the GT2000 high-precision electron beam metrology system

Hitachi High-Tech Corporation, Japan, launched the GT2000 high-precision electron beam metrology system to meet the needs of semiconductor device development and mass production in the high-NA EUV generation.

New candidate for universal memory is fast, low-power, stable and long-lasting

Researchers at Stanford University have demonstrated that a new material may make phase-change memory an improved option for future AI and data-centric systems.

Noninvasive technique tracks light through photonic circuits

Researchers at the Technion – Israel Institute of Technology, Israel, have shown how to exploit the natural nonlinearity of silicon to track the propagation of light through a circuit to characterize a chip’s performance.

Compressor cracks cited in Canadian helo crash

Fractures in the sixth-stage compressor wheel triggered a catastrophic engine failure and caused the April 2022 fatal crash of a Kestrel Helicopters 1981 Hughes 369D during long-line slinging operations in British Columbia, according to a recently released report from Canada’s Transportation Safety Board.

Valeo and Teledyne FLIR announce agreement and first contract for thermal imaging for automotive safety systems

Valeo, France, key technology partner of mobility actors around the globe, and Teledyne FLIR, Wilsonville, OR, part of Teledyne Technologies Incorporated, have started a strategic collaboration to bring thermal imaging technology to the automotive industry to enhance the safety of road users.

ZEISS to embark on cooperation with BORG Automotive

ZEISS, Germany, is entering into a cooperation with BORG Automotive, one of Europe’s leading independent remanufacturers of automotive parts.

Confluent announces significant investment in ATI nitinol melt expansion

Confluent Medical Technologies (Confluent) announced that it has partnered with ATI to invest more than $50 million over the next several years in ATI’s Nitinol melt and materials conversion infrastructure. With this significant investment, which will more than triple ATI’s melt capacity for medical Nitinol, Confluent will become ATI’s fulfillment partner and provide a suite of value-added services and order fulfillment for ATI medical Nitinol mill product.

“The growth in Neurovascular, Electrophysiology, Structural Heart, Peripheral Vascular, and Orthopedic device markets is driving an 18% growth rate (CAGR) in Nitinol demand. Given the substantial equipment and infrastructural cost needed to increase supply chain capacity, the industry has struggled to support this growth,” stated Dean Schauer, CEO and President of Confluent. “Our investment in this critical infrastructure will provide the necessary mid-term and long-term melt and conversion capacity necessary to meet and support Nitinol material demand. As the most trusted supply partner for our OEM customers, Confluent is pleased to be making this investment in creating a reliable supply chain so that OEMs can continue providing life-saving devices in these specialized markets.”

“ATI is honored to partner with Confluent in producing what is literally a life-saving material,” said Rob Foster, President of ATI’s Specialty Alloys & Components business. “We appreciate the value Confluent places on our expertise and capabilities as the industry leader in Nitinol production. Confluent’s investment in ATI’s growth will ensure the stable supply of Nitinol the industry needs for growth.” The expansion at ATI’s Millersburg, Oregon facility is expected to come online in 2027.

With these expanded capabilities and capacity investments, Confluent will continue to provide customers with the most reliable supply chain delivering the broadest level of Medical Nitinol services in mill products, hollows, tubes, wires, and components.

For more information: Confluent

Zurich Instruments joins project to entangle error-corrected qubits

Zurich Instruments, Switzerland, joins forces with two leading experimental labs at ETH Zurich and MIT, the quantum computing startup Atlantic Quantum, and leading theorists at Université de Sherbrooke and Forschungszentrum Jülich to participate in the SuperMOOSE project, which aims to entangle two error-corrected qubits and thus lay the foundation for future quantum computers.

Quintus hot isostatic press powers new UK HIP centre

Quintus, Västerås, Sweden, has supplied a Hot Isostatic Press (HIP) to Wallwork Group’s new HIP Centre stated to open in Bury, North Manchester, England, in September 2023. The press is the model QIH 173L M URC, equipped with Quintus’ proprietary uniform rapid cooling (URC), a feature that delivers the high material uniformity required of parts designed formission-critical applications, while enabling increased productivity with optimal temperature control.

Operating at a maximum temperature of 1250°C (2282°F) and pressure of 207 MPa (30,000 psi), the technologically advanced press has a work zone measuring 800 mm (34.6 inches) in diameter and 2550 mm (100.4 inches) high, and a capacity of over 7000 kg (15,432 lbs) per cycle.

Read further here.

Nitrex strengthens global presence in extrusion

Nitrex, Quebec, successfully commissioned two nitriding systems for Alumil S.A., Greece’s largest extrusion company and the leading producer of architectural systems, with an international sales network in over 60 countries worldwide.

With this collaboration, Nitrex further strengthens its global presence in extrusion profile manufacturing, demonstrating the industry’s confidence in Nitrex’s expertise to optimize die performance, increase the throughput of extruded profiles, and reduce overall tooling costs.

Catering to various sectors, including construction, automotive, energy, and more, and serving as a key exporter to Europe, the Middle East, and the USA, Alumil has recently started up two pit-type nitriding systems installed at separate locations. The first system, an NX-1215 model with a 3-ton load capacity, is operational at Alumil’s facility in Greece. The second system, an NX-620 furnace model with a 1.2-ton load capacity, is located at the company’s operation in Serbia.

The turnkey solution provided by Nitrex includes the exclusive Nitreg® technology, ensuring consistent and superior nitriding results. In anticipation of Alumil’s plans to expand manufacturing capacities in Greece, the system installed at this location has been specially sized up to accommodate future growth.

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