Nikon Corporation, Japan, launched the NEXIV VMF-K Series, a next-generation video measuring system designed to meet the increasing demands of semiconductor and electronic component inspection while significantly improving measurement throughput.
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Imina Technologies, Switzerland, is now the exclusive supplier of Electrical Failure Analysis solutions from point electronic GmbH, Germany.
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Ironwood Electronics, Eagan, Minn., is now producing elastomer sockets which include a protective “P” layer that allows for more insertions by protecting the elastomer from erosion and debris build up, extending the life of the elastomers to 200,000 plus insertions.
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TESCAN Group, a.s, Czech Republic, a leading global manufacturer of electron microscopes and advanced scientific instruments, has acquired EXpressLO LLC, Lehigh Acres, Fla., a provider of innovative FIB lift-out solutions for specimen preparation in STEM and other analytical techniques.
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NenoVision, Czech Republic, a leading innovator in advanced microscopy solutions, has been honored with the esteemed R&D 100 Award in the Analytical/Test category for its AFM-in-SEM LiteScope technology.
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QuantumDiamonds GmbH, Germany, a pioneer in quantum sensing technology, released the QD m.0, the first commercial quantum device designed specifically for semiconductor chip failure analysis, using diamond-based quantum microscopy to detect and localize faults in integrated circuits with high precision.
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A team of academic and enterprise researchers at Penn State has developed a synthesis process to produce a “rust-resistant” coating with additional properties ideal for creating faster, more durable electronics.
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Bruker Corporation, Billerica, Mass., released the Dektak Pro stylus profilometer, the next-generation profiler in the industry-leading Dektak product line, expanding measurement area and accuracy for critical analyses.
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Amkor Technology Inc., Tempe, Ariz., signed a preliminary agreement with the U.S. Department of Commerce for up to $400 million in funding under the CHIPS and Science Act to create a new $2 billion semiconductor packaging facility in Peoria, Arizona, the largest outsourced advanced packaging and test facility in the United States, generating approximately 2,000 jobs.
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Oxford Instruments plc, United Kingdom, a leading provider of high technology products and services to industry and scientific research communities, completed the acquisition of FemtoTools AG, Switzerland. The acquisition was first announced on 11 June 2024, and has been completed following the satisfactory conclusion of closing conditions.
FemtoTools specializes in measuring and imaging the properties (primarily the hardness and stiffness) of materials for research and semiconductor applications at very high resolution via a technique called nanoindentation. It joins Oxford Instruments’ Imaging & Analysis division, where its products will be sold in conjunction with the Group’s existing range of materials analysis tools, including electron microscope micro-analyzers and Raman microscopes.
Richard Tyson, chief executive officer, Oxford Instruments plc, said: “We are delighted to have completed the acquisition of FemtoTools. We welcome our new colleagues and look forward to working with them to integrate nanoindentation – a new technique to Oxford Instruments – into our extensive portfolio of materials analysis capabilities.”
Christian Lang, managing director, Materials Analysis, Oxford Instruments plc, said: “We’re so pleased that the FemtoTools team have chosen to join Oxford Instruments. We’ve had a number of very positive meetings since the announcement and are already making plans for our future together.
“I’m looking forward to integrating FemtoTools’ brilliant technology into our wider product range, and to working with this talented group of people.”
Felix Beyeler, co-founder of FemtoTools, said: “The team and I are very excited for the journey ahead as part of Oxford Instruments. Working together will enable us to extend the reach of our technology and provide even richer analysis to our combined customer base. We’re also looking forward to learning from the hugely experienced Oxford Instruments team.”
For more information:
Oxford Instruments plc
https://www.oxinst.com
The U.S. Department of Energy’s Argonne National Laboratory joined with Purdue University, West Lafayette, Ind., to identify collaborative areas in technology and research as a springboard for new joint microelectronics projects, taking a multidisciplinary approach to studying everything from materials and devices to software and manufacturing techniques.
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Researchers at the US Department of Energy’s Argonne National Laboratory have discovered why and how one of the more promising cathode materials in lithium ion batteries – single crystalline nickel-rich lithium nickel manganese cobalt oxide – degrades with use.
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NEOTech, Chatsworth, Calif., a leading provider of electronic manufacturing services, design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, announced a significant investment in and acquisition of state-of-the-art three-dimensional Computed Tomography scan equipment for its engineering laboratory.
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A new computer vision technique developed by MIT engineers significantly speeds up the characterization of newly synthesized electronic materials.
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An improved technique for analyzing single-atom defect structures and minor electron behavior disturbance in semiconductor and other materials has been demonstrated by researchers from the University of Tsukuba in Japan using time-resolved atomic force microscopy combed with ultra-short laser pulse technology.
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TESCAN GROUP, a.s., Czech Republic, completed its acquisition of TESCAN KOREA, Ltd. and Daeil Microanalysis Laboratory, after two decades of successful collaboration consolidating efforts to better serve the Korean customers and market, particularly in the semiconductor domain.
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Henkel, Germany, released a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
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The Fraunhofer Institute for Material and Beam Technology IWS in Germany is showcasing the second generation of its user-friendly laser-induced surface wave spectroscopy technology, called LAwave, at the “Control” trade fair in April 2024, facilitating the transition of this research-proven technology into industrial applications.
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Hitachi High-Tech Corporation, Japan, launched the GT2000 high-precision electron beam metrology system to meet the needs of semiconductor device development and mass production in the high-NA EUV generation.
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The National Institute of Standards and Technology ongoing project will improve time-resolved-emission microscopy by tailoring its’ single-photon detectors and scaling up these sensors to the megapixel level.
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Researchers at the Technion – Israel Institute of Technology, Israel, have shown how to exploit the natural nonlinearity of silicon to track the propagation of light through a circuit to characterize a chip’s performance.
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Scientists at Virginia Tech, Blacksburg, Va., synthesized a composite material whose properties make it an ideal candidate for the burgeoning field of flexible electronics.
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Thermo Fisher Scientific, Hillsboro, Ore., introduced the Thermo Scientific Metrios 6 Scanning Transmission Electron Microscope ((S)TEM) — a new-generation, fully automated (S)TEM metrology solution to help enhance productivity and deliver data quality assurance for high-volume semiconductor manufacturing.
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Onsemi, Scottsdale, Ariz., opened an application test lab in Piestany, Slovakia, focused on the advancement of system solutions for battery/plug-in hybrid/electric vehicles and energy infrastructure power conversion systems.
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Thermo Fisher Scientific, Hillsboro, Ore., the world leader in serving science, introduced the Thermo Scientific Meridian EX System— an electron-beam-based failure analysis solution designed to enable precise fault localization on advanced semiconductor logic technologies that helps users localize defects within complex power networks and achieve 10X improvement in spatial resolution compared to optical fault isolation solutions.
Continue readingUniversal Scientific Industrial (Shanghai) Co., Ltd., China, developed an advanced electronic component failure analysis technology to meet the increasingly complex and diverse needs of system-in-package miniaturized products.
Continue readingWith more than 50 years of innovation in mass spectrometry, JEOL, Japan, is pushing science a step further with their introduction of msFineAnalysis AI, an artificial intelligence-powered software designed to automatically perform qualitative GC-MS analysis.
Continue readingRigaku, Japan, leading provider of X-ray metrology solutions for semiconductor in-line processes, research and development, and high-volume manufacturing, has opened its first Semiconductor Metrology Technology Center in Sunnyvale, CA.
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FormFactor, Inc., Livermore, Calif., a leading semiconductor test and measurement supplier, opened a new product demonstration and training center in San Jose, California. The facility is staffed with applications engineers and training professionals, and features
FormFactor engineering wafer probers, metrology systems and advanced probe cards outfitted to meet semiconductor test and measurement requirements from lab to fab, including solutions for advanced packaging, automotive high-power devices, high-speed digital, silicon photonics, and 5G/6G/millimeter-wave mobile devices.
“The opening of our new demonstration center provides easy access for our customers to see first-hand the benefits of our sophisticated wafer probe and metrology solutions,” said Amy Leong, senior vice president and chief commercial officer. “We are deeply committed to enabling industry innovation, and proud to offer this center to accelerate our customers’ success with personalized, hands-on training, product demonstration, and support.”
FormFactor’s new demonstration center is located in the heart of Silicon Valley and offers a product demonstration lab and clean room, presentation and training areas, service warehouse, office space and conference rooms. The new location complements the capabilities of FormFactor’s existing global demonstration centers in Europe and Asia, and recently opened Advanced Quantum Cryogenic Lab in Boulder, Colorado.
For more information:
FormFactor, Inc.
