A new study conducted by researchers from the University of Delaware’s Center for Composite Materials (CCM) and DuPont Specialty Products, Wilmington, Del., now provides insights about a composite material that can be used to make thin, flexible and durable circuit boards.
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Researchers at Lawrence Livermore National Laboratory, Livermore, Calif., have furthered a new type of soft material that can change shape in response to light, a discovery that could advance “soft machines” for a variety of fields, from robotics to medicine.
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Researchers at Stanford University have demonstrated that a new material may make phase-change memory an improved option for future AI and data-centric systems.
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Researchers at the Department of Energy’s Pacific Northwest National Laboratory, Richland, Wash., found that adding a small amount of solid carbon to copper boosts its ability to conduct electricity—industry applications abound.
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Imec, Belgium, a world-leading research and innovation hub in nanoelectronics and digital technologies, created a perovskite LED stack that emits light a thousand times brighter than state-of-the-art OLEDs, representing a pivotal milestone towards the development of a perovskite injection laser with potential applications in image projection, environmental sensing, medical diagnostics.
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Researchers at Nagoya University in Japan used artificial intelligence to discover a new method to understand dislocations in polycrystalline materials, materials widely used in information equipment, solar cells, and electronic devices, that can reduce their efficiency.
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Intel, Santa Clara, Calif., launched its Intel Core Ultra mobile processors that deliver reimagined power efficiency, world-class compute and graphics performance and the best AI PC experience to mobile platforms and out to the edge.
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Chinese researchers have developed an easy-to-build, low-cost 3D nanoprinting system that can create arbitrary 3D structures with extremely fine features, precise enough to print metamaterials as well as a variety of optical devices and components such as microlenses and micro-optical devices.
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For the first time, scientists at Sandia National Laboratories, Albuquerque, N.M. and Texas A&M University, have witnessed pieces of metal crack, then fuse back together without any human intervention, overturning fundamental scientific theories in the process.
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University of Wisconsin–Madison engineers have used a spray coating technology to produce a new workhorse material that can withstand the harsh conditions inside a fusion reactor.
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Researchers from Stanford University, Palo Alto, Calif., sent an investigation to the space station to leverage microgravity to improve the synthesis of materials for photovoltaic devices designed to convert sunlight into electricity for solar energy applications.
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Researchers at North Carolina State University, Raleigh, N.C., have created a robot called RoboMapper that can rapidly identify new perovskite materials with improved stability and solar cell efficiency and is capable of conducting experiments more efficiently and sustainably to develop a range of new semiconductor materials with desirable attributes.
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Developed by researchers from Lawrence Berkeley National Laboratory (Berkeley Lab) and UC Berkeley, a new semiconducting material called “multielement ink” is the first “high-entropy” semiconductor that can be processed at low or room temperature, making the semiconductor purification and development process significantly less heat-intensive and more sustainable.
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Researchers at the University of Illinois Urbana-Champaign have developed a semiconductor device made using diamond, that has the highest breakdown voltage and lowest leakage current compared to previously reported diamond devices.
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An international team, including researchers from Washington University in St. Louis, Massachusetts Institute of Technology, Yonsei University and Inha University in Korea, Georgia Institute of Technology, and the University of Notre Dame, has demonstrated the monolithic 3D integration of layered 2D material into novel processing hardware, addressing the challenge of increased information transfer time between functional components in advanced computer chips and paving the way for AI computing.
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While it can take years of focused laboratory work to determine how to make the highest quality materials for use in electronic and photonic device applications, researchers at North Carolina State University developed an autonomous system that can identify how to synthesize “best-in-class” materials in hours or days.
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Researchers at the University of Strathclyde, Scotland, demonstrated a continuous roller printing process that can pick up and transfer over 75,000 micrometer-scale semiconductor devices in a single roll with very high accuracy, paving the way to creating large-scale arrays of optical components that could be used to rapidly manufacture micro-LED displays.
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In the latest advance in nano- and micro-architected materials, engineers at Caltech, Pasadena, Calif., developed a new material made from numerous interconnected microscale knots that made the material far tougher than identically structured but unknotted materials.
Continue readingResearchers at MIT, Cambridge, Mass., used deep learning to compare a vast amount of simulated data about the exterior force fields of materials with the matching internal structure, and from there, they developed a system that could reliably predict the interior from the surface data.
Continue readingIn a new study, Lam Research Corp., Fremont, Calif., examined the potential for the use of artificial intelligence in process development for chip fabrication and found that a “human first, computer last” approach can reach process engineering targets dramatically faster and at half the cost compared to today’s approach.
Continue readingShape Memory and Superelasticity was pleased to be a part of virtual IMAT by hosting a session on Tuesday, October 27, 2020. The session was hosted by journal editor-in-chief, Huseyin Sehitoglu, University of Illinois at Urbana-Champaign, and included six prerecorded presentations, each followed by a live question and answer session with the presenter.
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