Researchers at the University of Tokyo, Japan, have synthesized highly uniform semiconducting nanotubes just 1 nanometer wide by growing molybdenum disulfide inside protective boron nitride tubes, validating decades-old theoretical predictions and offering a new path for miniaturized electronic devices.
Continue readingSpray Tips: Disadvantages of thermal spraying
As with all coating technologies, thermal spray has some limitations; understanding them is important so that engineers can design effective solutions to the challenges of surface modification.
Continue readingMicrostructure on demand for additive manufacturing
Fraunhofer ICON Project “UltraGRAIN” demonstrates local microstructure control in metallic components during laser-based directed energy deposition, using pulsed-laser-induced melt pool excitation with potential for tailored products.
Continue readingStacking up: A new take on diamond electronics
Researchers at the U.S. Department of Energy’s Argonne National Laboratory have overcome a critical barrier in diamond-based electronics and microelectronics by using nanotechnology to integrate two-dimensional materials for efficient n-type doping, a breakthrough in electronic materials designed to operate in high-temperature environments and other harsh environments.
Continue readingNew sensor measures strain, strain rate, and temperature with single material layer
Researchers from the Institute of Metal Research of the Chinese Academy of Sciences have developed an innovative flexible sensor that can simultaneously detect strain, strain rate, and temperature using a single active material layer, representing a significant advance in multimodal sensing technology.
Continue readingData transfer speeds increase significantly through new optical chip design
A team from the Center for Optics, Photonics and Lasers at Laval University, Quebec, Canada, has come up with an optical chip that can transfer massive amounts of data at ultra-high speed, offering unrivaled energy efficiency.
Continue readingBringing powerful 3D X-ray microscopy to smaller labs
Researchers at the University of Michigan have developed a technique that allows the study of microstructures inside metals, ceramics, and rocks using X-rays in a standard laboratory, eliminating the need to travel to a particle accelerator. This advancement makes 3D X-ray diffraction (3DXRD) more accessible, enabling rapid analysis of samples and prototypes in both academic and industrial settings, and providing more opportunities for student involvement. 3DXRD works by reconstructing 3D images from X-rays taken at multiple angles, similar to a CT scan, but with the material sample rotating in front of a powerful beam that emits about a million times more X-rays than a medical X-ray.
The huge X-ray concentration produces a micro-scale image of the tiny fused crystals that make up most metals, ceramics and rocks, known as polycrystalline materials.
Results help researchers understand how materials react to mechanical stresses by measuring thousands of individual crystals’ volume, position, orientation and strain. For example, imaging a sample from a steel beam under compression can show how crystals respond to bearing the weight of a building, helping researchers understand large-scale wear.
Synchrotrons were once the only facilities able to produce enough X-rays for 3DXRD as electrons spit off scads of X-rays as they travel through circular particle accelerators, which can then be directed into a sample.
While synchrotron X-ray beams produce state-of-the-art detail, there are only about 70 facilities worldwide. Research teams must put together project proposals for “beam time.” Accepted projects often must wait six months to up to two years to run their experiments, which are limited to a maximum of six days.
In an effort to make this technique more widely available, the research team worked with PROTO Manufacturing to custom build the first laboratory-scale 3DXRD. As a whole, the instrument is about the size of a residential bathroom, but could be scaled down to the size of a broom closet.
“This technique gives us such interesting data that I wanted to create the opportunity to try new things that are high risk, high reward and allow teachable moments for students without the wait-time and pressure of synchrotron beam time,” said Ashley Bucsek, U-M assistant professor of mechanical engineering and materials science and engineering and co-corresponding author of the study published in Nature Communications.
Previously, small-scale devices could not produce enough X-rays for 3DXRD because at a certain point, the electron beam pumps so much power into the anode—the solid metal surface that the electrons strike to make X-rays—that it would melt. Lab-3DXRD leverages a liquid-metal-jet anode that is already liquid at room temperature, allowing it to take in more power and produce more X-rays than once possible at this scale.
The researchers put the design to the test by scanning the same titanium alloy sample using three methods: lab-3DXRD, synchrotron-3DXRD and laboratory diffraction contrast tomography or LabDCT—a technique used to map out crystal structures in 3D without strain information.
Lab-3DXRD was highly accurate, with 96% of the crystals it picked up overlapping with the other two methods. It did particularly well with larger crystals over 60 micrometers, but missed some of the smaller crystals. The researchers note that adding a more sensitive photon-counting detector, which detects the X-rays that are used to build the images, could help catch the finest-grained crystals.
With this technique available in-house, Bucsek’s research team can try new experiments, honing parameters to prepare for a larger experiment at a synchrotron.
“Lab-3DXRD is like a nice backyard telescope while synchrotron-3DXRD is the Hubble Telescope. There are still certain situations where you need the Hubble, but we are now well prepared for those big experiments because we can try everything out beforehand,” Bucsek said.
Beyond enabling more accessible experiments, lab-3DXRD allows researchers to extend projects past the synchrotron six day limit, which is particularly helpful when studying cyclic loading—how a material responds to repeated stresses over thousands of cycles.
For more information: The Michigan Center for Materials Characterization
Image: Members of Professor Ashley Bucsek’s lab group are able to use three-dimensional X-ray diffraction to study polycrystalline materials on campus, a technique previously only available in specialized synchrotron facilities. Left to right: Ashley Bucsek, Sangwon Lee, Wenxi Li, Abdulhamit Sarac, Janice Moya and Yuefeng Jin. Image credit: Marcin Szczepanski, Michigan Engineering
New PCR chip design: High-pressure liquid seal solves bubble problem
Researchers from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, developed a high-pressure liquid seal technique that eliminates bubble formation in PDMS-based PCR chips by proving that water vapor diffusion—not air expansion—is the main cause of bubbles.
Continue readingA new ultrathin conductor for nanoelectronics
Researchers at Stanford Engineering have developed an ultrathin material that conducts electricity better than copper and could enable more energy-efficient nanoelectronics.
Continue readingReducing TOPCon solar cell degradation via copper plating
Researchers at the University of New South Wales, Australia, have created a protective barrier on the front silver grid of a TOPCon solar cell using a 1 µm copper plating layer, which reduces corrosion susceptibility and significantly lowers contaminant-induced degradation compared to unprotected reference devices.
Continue readingSLAC will play a key role in DOE’s new research centers for advancing next-generation microelectronics
The Department of Energy has announced funding $179 million for three Microelectronics Science Research Centers that bring together multi-institutional, multidisciplinary projects in partnership with industry organized around making microelectronics more energy efficient and able to operate better in extreme environments.
Continue readingElectronic components can self-assemble using new technique
Researchers from North Carolina State University have developed a new technique for creating simple electronic device components that proved effective in recent tests, indicating that self-assembly for more complex electronics, such as 3D computer chips, could be possible.
Continue readingScalable 3D chips with high-speed interconnections
Researchers at the Massachusetts Institute of Technology have developed a technique to create a multilayered chip with alternating layers of high-quality semiconducting material grown directly on top of one another.
Continue readingTailoring material properties with exquisite precision
Penn State researchers have discovered that “atomic spray painting” of potassium niobate can precisely manipulate a material’s properties by altering its atomic arrangement, potentially leading to environmentally friendly innovations in consumer electronics, medical devices, and quantum computing.
Continue readingThermo Fisher highlights use of advanced SEM for metal quality control analysis
Thermo Fisher Scientific, Waltham, Mass., has highlighted the ability of scanning electron microscopy to successfully capture defects when conducting failure analysis on metals.
Continue readingNanoscale transistors could enable more efficient electronics
In order to overcome a fundamental limit of silicon semiconductor technology that prevents transistors from operating below a certain voltage, Massachusetts Institute of Technology researchers fabricated a different type of three-dimensional transistor using a unique set of ultrathin semiconductor materials.
Continue readingSupersonic microprojectiles reveal new insights into metal bonding
Using a custom-built machine to launch microprojectiles at supersonic speeds, Cornell researchers, Ithaca, N.Y., have uncovered new details about how high-speed metallic collisions can form strong, durable atomic bonds, offering insights that could enhance 3D printing and other manufacturing techniques.
Continue readingWater-free manufacturing approach could advance 2D electronics integration
A team of academic and enterprise researchers at Penn State has developed a synthesis process to produce a “rust-resistant” coating with additional properties ideal for creating faster, more durable electronics.
Continue readingThere’s two sides to this semiconductor, and many simultaneous functions
Cornell University researchers, Ithaca, N.Y., in collaboration with a team at the Polish Academy of Sciences, have developed the first dual-sided – or “dualtronic” – chip that combines photonic and electronic functions simultaneously, an innovation that could shrink the size of functional devices, make them more energy efficient and reduce manufacturing costs.
Continue readingOrdered defects may be key for solution-deposited semiconductors
Researchers at the University of Illinois Urbana-Champaign discovered that ordered defect pairs in solution-deposited semiconductors lead to record-high transistor performance, challenging conventional wisdom in semiconductor manufacturing.
Continue readingScientists uncover detailed structure of the aluminum oxide surface
Researchers from TU Wien, Austria, and the University of Vienna have recently unraveled the complex structure of the Al2O3 surface, a puzzle that had eluded precise determination for over half a century.
Continue readingNewly discovered role of phase separation: a game changer for AI memory tech
Researchers on a team led by University of Michigan unveiled that phase separation, alongside oxygen diffusion, crucially supports the long-term retention of information in memristors, specifically in resistive random access memory.
Continue readingA quantum leap for motion sensing
For the first time, researchers at Sandia National Laboratories, Albuquerque, N. M., have used silicon photonic microchip components to perform a quantum sensing technique called atom interferometry, an ultra-precise way of measuring acceleration and the latest milestone toward developing a kind of quantum compass for navigation when GPS signals are unavailable.
Continue readingKyocera introduces cutting-edge Peltier module with 21% increase in cooling performance
Kyocera Corporation, Japan, launched a new Peltier (thermoelectric) module that boasts a maximum heat absorption rate 21% higher than its conventional products, significantly enhancing cooling performance for applications such as automotive battery and seat temperature control.
Continue readingArgonne, Purdue University explore collaborations to advance next-generation microelectronics
The U.S. Department of Energy’s Argonne National Laboratory joined with Purdue University, West Lafayette, Ind., to identify collaborative areas in technology and research as a springboard for new joint microelectronics projects, taking a multidisciplinary approach to studying everything from materials and devices to software and manufacturing techniques.
Continue readingChaco metamaterial paves the way for exciting applications in memory storage
Scientists at Los Alamos National Laboratory, N. M., and Tel Aviv University, Israel, have achieved a breakthrough in material science with the creation of “Chaco,” a revolutionary metamaterial named after the historical site Chaco Canyon in New Mexico.
Continue readingPOSTECH researchers maximize the efficiency of hafnia-based ferroelectric memory devices
Researchers at Pohang University of Science and Technology, South Korea, have significantly enhanced the data storage capacity of ferroelectric memory devices using hafnia-based ferroelectric materials and an innovative device structure.
Continue readingTurning up the heat on data storage: New memory device paves the way for AI computing in extreme environments
Researchers at University of Pennsylvania demonstrated memory technology capable of enduring temperatures as high as 600° Celsius—more than twice the tolerance of any commercial drives on the market—and these characteristics were maintained for more than 60 hours, indicating exceptional stability and reliability.
Continue readingGroundbreaking microcapacitors could power chips of the future
Scientists at Lawrence Berkeley National Laboratory, Berkeley, Calif., developed microcapacitors with ultrahigh energy and power density, paving the way for on-chip energy storage in electronic devices.
Continue readingTwo-faced solar panels can generate more power at up to 70% less cost
Researchers at the University of Surrey, England, University of Cambridge, the Chinese Academy of Sciences, Xidian University, and Zhengzhou University, China, built a new kind of two-faced (bifacial) solar panel using single-walled carbon nanotubes as both front and back electrodes that are the highest efficiency single junction solar cells to date.
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