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1458 items found
Helios PFIB enables advanced failure analysis of semiconductors
Published: July 25, 2016
FEI Co., Hillsboro, Ore., offers the Helios PFIB, said to be the world's most advanced DualBeam Plasma FIB platform for large area deprocessing to enable electrical fault isolation of advanced process ICs and advanced failure analysis of 3D packages.
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X-ray metrology system designed for in-line monitoring of logic devices
Published: July 25, 2016
Bruker Corp., Billerica, Mass., Germany, announces that multiple leading logic and foundry manufacturers have selected Bruker's JVX7300LSI X-ray metrology system to support their ramp and development for 10 nm and 7/5 nm technology nodes.
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Cadence announces Intel- certified implementation and signoff tools
Published: July 25, 2016
Cadence Design Systems Inc., San Jose, Calif., announces that its implementation and signoff tools have achieved certification on the Intel third-generation 10 nm tri-gate process for customers of Intel Custom Foundry.
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Hitachi Conductor etch system supports double patterns and 3D structures
Published: July 25, 2016
Hitachi High-Tech, Schaumburg, Ill., has developed the 9000 Conductor Etch Series to support next-generation devices at 20 nm and below that require double-patterning, 3D structures, and complex, high-precision processes.
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Mentor Graphics to provide access to AMS design flow for ARM Cortex-M0
Published: July 25, 2016
Mentor Graphics Corp., Wilsonville, Ore., has announced a collaboration with ARM to provide accessible and affordable access to Mentor's Tanner AMS analog/mixed-signal design flow for ARM Cortex-M0 processor-based implementations as part of the ARM DesignStart program.
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Roger Jones of Solar Atmospheres nominated as ASM Trustee
Published: July 06, 2016
Solar Atmospheres, Souderton, Pa., announces that Roger Jones, corporate president, has been nominated as a trustee for the ASM International Board of Trustees, effective October 2016.
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Advanced Mask and Bond Aligners enable more accurate wafer processing
Published: July 01, 2016
Suss MicroTec, Germany, has launched the fourth generation of its semi-automated Mask and Bond Aligners, including a new platform system and major improvements in alignment accuracy, ergonomic design, and further reduced cost of ownership.
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Allvia expands capacity to manufacture wafers with glass and quartz interposers
Published: July 01, 2016
Allvia, Sunnyvale, Calif., has expanded its capacity for glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers.
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Extreme selectivity etch tool enables atomic-level precision for 3D logic chips
Published: July 01, 2016
Applied Materials Inc., Santa Clara, Calif., introduces its Applied Producer Selectra System, the industry's first extreme selectivity etch tool that presents new materials engineering capabilities for continued scaling of 3D logic and memory chips.
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SEMI report: 19 new fabs and lines to start construction
Published: June 19, 2016
SEMI, San Jose, Calif., announces that 19 new fabs and lines are forecast to begin construction in 2016 and 2017, according to the latest update of the SEMI World Fab Forecast report.
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