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1458 items found
FEI launches three tools for next-generation semiconductor failure analysis
Published: June 19, 2016
FEI Co., Hillsboro, Ore., introduces three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing: the Helios G4 DualBeam EXL, The Metrios DX TEM, and the ExSolve 2 WTP.
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Thermo Fisher Scientific acquires FEI Company for $4.2 billion
Published: June 19, 2016
Thermo Fisher Scientific Inc., Waltham, Mass., announces that it is to acquire FEI Co., Hillsboro, Ore., for approximately $4.2 billion.
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Large-area ALD system enables encapsulation of large sheets of organic components
Published: June 18, 2016
Picosun Oy, Finland, has developed atomic layer deposition (ALD) equipment specifically designed for large-area flexible electronics encapsulation.
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IBM scientists achieve phase-change memory breakthrough
Published: June 18, 2016
IBM Research, Schenectady, N.Y., reports that its scientists have demonstrated reliably storing three bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).
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Multifunctional heating and electrical system enables in-situ TEM and SEM analysis
Published: June 18, 2016
Protochips, Morrisville, N.C., has released its Fusion multi-functional heating and electrical system for in-situ electron microscopy.
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Pulsed magnetic field instrument incorporating lasers enables 100 measurements per pulse
Published: June 17, 2016
The University of Manchester, England, announces that a research team has developed a pulsed magnetic field instrument incorporating ultrafast lasers that enable 100 measurements per pulse, with the goal of facilitating rapid progress in semiconductor device development.
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Striking semiconductors with light in the furnace could reduce defects
Published: June 17, 2016
The University of Utah, Salt Lake City, and the National Renewable Energy Laboratory, Golden, Colo., report that its researchers have discovered that if light is shone on semiconductor alloys as they are fired in a furnace at high temperatures, the light generates extra electrons that could suppress the growth of defects.
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ASML to acquire HMI for semiconductor inspection and e-beam metrology
Published: June 17, 2016
ASML Holding NV (ASML), The Netherlands, a provider of lithography systems for the semiconductor industry; and Hermes Microvision Inc. (HMI), Taiwan, a supplier of pattern verification systems for advanced semiconductor devices, have entered into an agreement under which ASML will acquire all outstanding shares of HMI in a cash transaction valued at about $3 billion.
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ZEISS partners with ASM International to supply microscopes and collaborate on training
Published: June 17, 2016
Instruments to be used for training on high precision manufacturing and materials testing techniques
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Women in engineering profile: Lesley D. Frame
Published: June 09, 2016
This new profile series introduces leading materials scientists from around the world who happen to be females. Here we speak with Lesley D. Frame, Director of Product Development for Thermatool Corp.
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