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1458 items found
Edax EBSD system directly measures incident electrons with no need for phosphors
Published: June 20, 2020
Edax Inc., Mahwah, N.J., has launched the world’s first commercially available direct electron detector designed for electron backscatter diffraction (EBSD).
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Samsung Electronics develops cloud chip design platform in collaboration with Rescale
Published: June 19, 2020
Samsung Electronics Co. Ltd., San Jose, Calif., introduces the Samsung Advanced Foundry Ecosystem (SAFE) cloud design platform for fabless customers, in collaboration with Rescale, a leader in high-performance computing applications in the cloud.
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Leica Microsystems 12-megapixel microscope camera can be operated without a PC
Published: June 19, 2020
Leica Microsystems, Germany, launches the new Flexacam C1 microscope camera, which turns microscopes into stand-alone digital imaging stations with no need for a PC.
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Five Jeol mass spectrometers selected for U.S. Customs and Border Protection labs
Published: June 19, 2020
Jeol USA, Peabody, Mass., announces that it has been awarded a major contract by the U.S. Department of Homeland Security Customs and Border Protection for five Jeol AccuTOF-DART direct analysis in real time, time-of-flight mass spectrometers.
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GlobalFoundries to implement ITAR at its advanced U.S. semiconductor facility
Published: June 19, 2020
GlobalFoundries, Santa Clara, Calif., announces plans to implement export control security measures at its most advanced semiconductor manufacturing facility, Fab 8, in Malta, New York.
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SEMI predicts 24 percent growth in fab equipment spending for 2021
Published: June 19, 2020
SEMI, Milpitas, Calif., predicts that 2021 is poised to mark a banner year for global fab equipment spending, with 24 percent growth to a record $67.7 billion, 10 percent higher than the previously forecast $65.7 billion.
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Oxford Instruments Asylum Research launches software for EDS and AFM data correlation
Published: June 17, 2020
Oxford Instruments Asylum Research, Santa Barbara, Calif., has released the new “Relate” software package for correlative imaging with Asylum Research AFMs, electron microscopes, and Oxford Instruments NanoAnalysis EDS and EBSD detectors.
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CHIPS for America Act creates incentives to produce semiconductors in United States
Published: June 15, 2020
The Semiconductor Industry Association (SIA), Washington, applauds the introduction in Congress of the Creating Helpful Incentives to Produce Semiconductors for America Act (CHIPS for America Act), bipartisan legislation that would invest tens of billions of dollars in semiconductor manufacturing incentives and research initiatives over the next five to ten years.
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Tescan Solaris X FIB-SEM features rocking stage for fast milling of large cross-sections
Published: May 22, 2020
Tescan, Czech Republic, reports that its Solaris X FIB-SEM equipped with an iFIB+ Xe plasma FIB column delivers the high currents needed to speed material removal for large cross-sections, and its rocking stage allows continuous monitoring.
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Ultra Tec’s Ultrapol Fiberlab fiber optic modular polishing system provides angular control
Published: May 21, 2020
Ultra Tec Manufacturing Inc., Santa Ana, Calif., introduces the Ultrapol Fiberlab module system, which provides all the angular control and polishing features required for the effective processing of bare optical fibers to produce a range of end shapes, including cones, bevels, flats, chisels (screwdriver), and beveled ball tips.
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