Plan Today to Attend and Participate at ISTFA 2027!
With a focus on both theoretical and practical applications, ISTFA 2027 promises to be an invaluable platform for professionals looking to enhance their expertise and stay at the forefront of microelectronics testing and failure analysis.
This premier gathering is your one-stop destination for leading-edge training, networking, and business opportunities across all market segments.
ISTFA 2027 (International Symposium for Testing and Failure Analysis)
Join us for the 53rd International Symposium for Testing and Failure Analysis (ISTFA) which is set to take place in Phoenix, Arizona, from October 31 – November 4, 2027. As the premier event for the microelectronics failure analysis community, ISTFA brings together leading experts, industry professionals, and researchers to share insights, innovations, and methodologies in the field. Attendees will engage in a comprehensive program that includes keynote presentations, technical sessions, workshops, and networking opportunities, all designed to foster collaboration and knowledge exchange.
ISTFA 2026 WINNERS
2026 Best Paper (First Place)
Parametric Laser Mapping (PLM): A fault isolation solution for analog soft failure
Mr. Lee Xiang Gan, Dr. Guofeng You, Mr. Aldrin R. Limos and Ms. Grace Tan
Presenting Author: Mr. Lee Xiang Gan, Qualcomm
2026 Outstanding Paper (Second Place)
Extracting signals in crosstalk environments through Laser Perturbation Probing
Dr. Venkat Ravikumar1, Mr. Winson Lua2, Mr. Kent Erington3, Ms. Angeline phoa4 and Mr. Kee Yang5, 1EPD, SIngapore University of Technology and Design, Singapore, Singapore, 2Device Analysis Lab, Advanced Micro Devices – Singapore Pte Ltd, Singapore, Singapore, Singapore, 3Advanced Micro Devices, Inc., Austin, TX, 4Device Analysis, Advanced Micro Devices – Singapore Pte Ltd, Singapore, Singapore, Singapore, 5Checkpoint Technologies, San Jose, CA
Presenting Author: Dr. Venkat Ravikumar, AMD
2026 Best Poster (First Place)
Non‑Destructive Metrology of PCBs and Advanced Packages Using 3D X‑ray Microscopy
Mr. Vasanth Somasundaram, Mr. Arun Karunanithi and Mr. Michell Espitia, Advanced Micro Devices, Inc., Austin, TX
Presenting Author: Mr. Vasanth Somasundaram, AMD
2026 Outstanding Poster (Second Place)
Low-Temperature CVD Oxide Deposition for Photoresist Protection
Ms. Ching-Shan Sung1, Dr. Yung Sung Yen2, Ms. Yuan Cheng Tang3, Dr. Ashok Ranjan4 and Ms. Bi Jen Chen5, 1YE, Micron, Taoyuan, Taiwan, 2OMT ADT LITHOGRAPHY, Micron, Taoyuan, Taoyuan, Taiwan, 3Micron, TAOYUN, TAOYUN, Taiwan, 4FA, Micron Technology, Taoyuan, Taoyuan, Taiwan, 5OMT YE, Micron, Taoyuan, Taoyuan, Taiwan
Presenting Author: Ms. Ching-Shan Sung, Micron Technology
2026 Student Poster Contest (First Place)
Optimization of Grayscale Exposure for Defect Correction in High-Resolution Photopolymer Lithography
Presenting Author: Mr. Jack R. Woelfel, University of Texas at Austin
2026 Student Poster Contest (Second Place)
Extracting Experimental Fatigue Material Parameters to Validate “Ultrafast” Fatigue Crack Growth Approach
Presenting Author: Destiny Ramirez, University of Texas at San Antonio
2026 Student Poster Contest (Third Place)
Low-Resistance Si-Implanted GaN via Capping-Free UV-Laser/Multi-RTA
Presenting Author: Mr. Chia H. Chang, Taiwan Semiconductor Research Institute (TSRI)
