International Roadmap for Failure Analysis

The International Roadmap for Failure Analysis (IRFA) serves as a collaborative industry initiative focused on identifying current and emerging challenges in semiconductor failure analysis and advancing solutions through shared expertise and innovation. Additional information regarding IRFA programming at ISTFA 2027, including keynote presentations, session topics, speakers, and scheduling details, is currently being developed and will be announced as it becomes available. Please check back for updates as the conference program continues to take shape.